Metal-Layer Joining for Flexible OLED Substrates
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Solution Overview
Problem
Conventional flexible flat panel display devices, such as OLEDs, face contamination issues and temperature limitations due to the use of organic adhesives, which also lead to non-uniform adhesion and increased production costs and time.
Innovation Solution
A method of joining a flexible layer to a support using metal layers, where the metal layers are cleaned and joined through a series of processes including drying, sonic cleaning, and annealing, eliminating the need for organic adhesives and improving adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic adhesive is used to attach the flexible substrate to the support, then the flexible substrate can be controlled during fabrication, but contamination occurs in the process chamber and processing time increases
Solution Approach 1:
The patent removes the organic adhesive layer from the bonding interface between the flexible substrate and support. Instead, it uses a metal layer (first metal layer on flexible substrate, second metal layer on support) that is directly bonded through metallurgical bonding, eliminating the source of organic contamination while maintaining strong adhesion.
Solution Approach 2:
The patent changes the bonding mechanism from chemical adhesion (organic adhesive) to metallurgical bonding (metal-layer bonding). This parameter change in the bonding method eliminates organic material from the process chamber, preventing contamination while achieving reliable adhesion through direct metal-to-metal bonding.
2Reliability
If organic adhesive is used to attach the flexible substrate to the support, then the flexible substrate can be controlled during fabrication, but the process temperature is limited to about 300° C. or less
Solution Approach 1:
The patent changes the bonding mechanism from chemical adhesion (organic adhesive) to metallurgical bonding (metal-layer bonding). This parameter change in the bonding method eliminates organic material from the process chamber, preventing contamination while achieving reliable adhesion through direct metal-to-metal bonding.
3Reliability
If organic adhesive is used to attach the flexible substrate to the support, then the flexible substrate can be controlled during fabrication, but uniform application is difficult and adhesion is non-uniform
Solution Approach 1:
The patent removes the organic adhesive layer from the bonding interface between the flexible substrate and support. Instead, it uses a metal layer (first metal layer on flexible substrate, second metal layer on support) that is directly bonded through metallurgical bonding, eliminating the source of organic contamination while maintaining strong adhesion.
Solution Approach 2:
The patent applies metal layers to the flexible substrate and support before the bonding process. These pre-applied metal layers provide uniform bonding surfaces that facilitate consistent metallurgical bonding, eliminating the need for precise adhesive application and ensuring uniform adhesion across the entire bonding interface.
4Reliability
If organic adhesive is used to attach the flexible substrate to the support, then the flexible substrate can be controlled during fabrication, but production costs and time increase due to cleaning requirements
Solution Approach 1:
The patent removes the organic adhesive layer from the bonding interface between the flexible substrate and support. Instead, it uses a metal layer (first metal layer on flexible substrate, second metal layer on support) that is directly bonded through metallurgical bonding, eliminating the source of organic contamination while maintaining strong adhesion.
Solution Approach 2:
The patent changes the bonding mechanism from chemical adhesion (organic adhesive) to metallurgical bonding (metal-layer bonding). This parameter change in the bonding method eliminates organic material from the process chamber, preventing contamination while achieving reliable adhesion through direct metal-to-metal bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces contamination, temperature dependency, and production costs while enhancing the uniformity and strength of the adhesion between the flexible layer and the support, simplifying the manufacturing process and increasing yield.
Implementation Method 1
a second cleaning step, the second cleaning step including cleaning the first and second metal layers via a D-sonic process or a rinsing process in deionized water
Implementation Method 2
a second joining process including pressing and annealing the first and second metal layers to each other
Data Source
AI summary
A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.