Metal-Insulated LED Substrate for Precise Lens Alignment
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Solution Overview
Problem
Existing semiconductor light-emitting devices, particularly those used in LiDAR systems, face challenges with large size, complex manufacturing processes, high costs, and low alignment accuracy due to the use of ceramic substrates, which are difficult to process and have large dimensional tolerances.
Innovation Solution
The use of a metal substrate combined with an insulating layer forms a substrate that is easier to process, allowing for high dimensional accuracy and improved alignment between the light-emitting unit and lens assembly, thereby enhancing beam correction and shaping accuracy, while also facilitating electrical connections and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate is used, then electrical insulation is provided, but the substrate is difficult to process and has large dimensional tolerances
Solution Approach 1:
The patent uses a composite substrate structure consisting of a metal substrate layer and an insulating layer. The metal substrate provides mechanical strength and ease of processing, while the insulating layer provides electrical insulation. This composite approach resolves the contradiction by combining materials with complementary properties, achieving both electrical insulation and manufacturing precision.
Solution Approach 2:
The patent changes the material parameters of the substrate from ceramic to a metal-insulating layer composite. This parameter change allows for better dimensional control during processing while maintaining electrical insulation properties. The insulating layer thickness and material composition can be precisely controlled to achieve the required electrical performance.
2Reliability
If a ceramic substrate is used, then electrical insulation is provided, but the processing complexity and cost increase
Solution Approach 1:
The composite substrate structure replaces difficult-to-process ceramic with a metal substrate combined with an insulating layer. The metal substrate is easier to process using conventional techniques, reducing manufacturing complexity and cost, while the insulating layer maintains the required electrical insulation properties.
Solution Approach 2:
The patent uses a cost-effective metal substrate instead of expensive ceramic substrate. The metal substrate can be processed more economically and disposed of or recycled more easily, reducing overall manufacturing costs while maintaining functional requirements.
3Ease of manufacture
If the substrate dimensional tolerance is large, then manufacturing is easier, but the alignment accuracy between light-emitting unit and lens assembly decreases
Solution Approach 1:
The metal-insulating layer composite substrate combines the ease of processing of metal with the precision capability of controlled layer deposition. The insulating layer can be deposited with precise thickness and positioning control, enabling accurate alignment features even though the metal substrate itself is processed with standard tolerances.
Solution Approach 2:
The insulating layer acts as an intermediary between the metal substrate and the mounted components. It provides a precisely controllable surface for positioning the light-emitting unit and lens assembly, mediating between the relatively low-precision metal substrate processing and the high-precision alignment requirements.
4Volume of moving object
If the device size is reduced, then miniaturization is achieved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent replaces ceramic substrate with a metal substrate that has superior thermal conductivity. This substitution provides enhanced heat dissipation capability through the substrate itself, allowing for effective thermal management in miniaturized devices without requiring additional complex cooling systems.
Solution Approach 2:
The composite structure of metal substrate with insulating layer provides both electrical insulation and thermal conduction pathways. The metal substrate serves as a heat sink and thermal conduction path, while the insulating layer maintains electrical isolation, enabling effective heat dissipation in compact configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more flexible, cost-effective, and efficient production process with improved assembly accuracy, reduced size, and enhanced heat dissipation, contributing to the miniaturization and cost reduction of semiconductor light-emitting devices.
Implementation Method 1
facilitating electrical connections and heat dissipation
Data Source
AI summary
The present disclosure provides a semiconductor light-emitting device and an electronic device with the semiconductor light-emitting device. The semiconductor light-emitting device includes a substrate, a lens assembly and a light-emitting unit. The substrate includes a metal substrate and an insulating layer covered on an outer surface of the metal substrate. The substrate also includes a first surface 101 and a second surface 102. The first surface includes a chip mounting area and a lens mounting area that are connected to each other. The lens assembly is disposed on the lens mounting area. The light-emitting unit is disposed on the chip mounting area. The lens assembly is located at a light emitting path of the light-emitting unit.