Metal Mask Micro Structure Etching for Film Uniformity
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Solution Overview
Problem
Conventional metal masks with large bottom face angles and small openings hinder film thickness uniformity and focus control in film coating processes, and reducing angles while maintaining opening density is challenging.
Innovation Solution
A metal mask manufacturing method involving multiple etching steps and layer formations to create micro structures with smaller bottom face angles and larger openings, including disposing anti-etching layers, forming concave parts, and sputter etching to achieve micro structure walls with specific angles and curvature radii.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional metal masks with large bottom face angles and small openings are used, then the manufacturing process is simple, but the film thickness uniformity and focus control are poor
Solution Approach 1:
The etching process is segmented into multiple steps: first etching to form initial concave parts, second etching to create voids, and third etching to form the final micro structure walls. This segmented approach enables precise control of the bottom face angle and opening size, achieving film thickness uniformity while managing manufacturing complexity through systematic process breakdown
Solution Approach 2:
Anti-etching layers are disposed on the substrate before etching to define the regions that will become micro structures. The protecting layer is filled into concave parts before the third etching. These preliminary actions establish the geometric constraints needed to achieve the target bottom face angle and opening dimensions, ensuring manufacturing precision
2Manufacturing precision
If the bottom face angle is reduced to improve film coating control, then the opening size decreases, but the distribution density of openings increases
Solution Approach 1:
The invention changes the geometric parameters of the micro structures by controlling the etching depth and angle in each etching step. The bottom face angle is specifically controlled to be between 10-30 degrees through the third etching process, while the opening size is maintained at a larger dimension. This parameter optimization allows the micro structure walls to converge properly, improving film coating control without excessive reduction in opening area
Solution Approach 2:
The invention transitions from conventional planar mask structures to three-dimensional micro structures with controlled bottom face angles and curved walls. By introducing the dimensional aspect of the bottom face angle and wall curvature, the invention achieves better film coating control while maintaining adequate opening sizes, as the three-dimensional geometry allows optimized material flow paths
3Manufacturing precision
If the bottom face angle is reduced to improve film coating control, then the manufacturing complexity increases, but the opening distribution density changes
Solution Approach 1:
The complex manufacturing process is segmented into three distinct etching steps with specific process parameters for each. The first etching forms initial concave parts, the second etching creates voids between them, and the third etching forms the final micro structure walls at the target angle. This segmentation makes the complex process manageable and repeatable, achieving film coating control through systematic process breakdown
Solution Approach 2:
Anti-etching layers and protecting layers serve as intermediaries that define the geometry of the final micro structures. These intermediary layers are disposed before etching and removed after etching, enabling precise control of the bottom face angle and opening dimensions without requiring direct manual manipulation, thus managing manufacturing complexity through intermediary process elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables improved control of film thickness uniformity and focus in film coating processes by creating metal masks with smaller bottom face angles and larger openings, overcoming the limitations of prior art.
Implementation Method 1
The third etching of the step (g) includes a sputter etching facing to the second face
Data Source
AI summary
A metal mask manufacturing method includes: (a) disposing a first anti-etching layer having a first void region on a first face of a substrate; (b) disposing a second anti-etching layer on a second face of the substrate opposite to the first face, wherein a second void region of the second anti-etching layer is corresponding to the first void region; (c) performing a first etching on the first face and the second face to form a first concave part and a second concave part separated by a part of the substrate; (d) disposing a protecting layer filled into the first concave part; (e) performing a second etching from the second face to produce a void between the first concave part and the second concave part; (f) removing the second anti-etching layer; and (g) performing a third etching from the second face.