Metal Mesh Layout to Prevent Intersection Buildup in Thin Film Sensors

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Solution Overview

Problem

Existing micro-nano processing technologies face challenges in achieving line widths less than 5 μm, leading to reduced optical transparency due to metal accumulation at intersections in thin film sensors and displays, particularly in transparent antennas and radio frequency devices.

Innovation Solution

A metal mesh design with crossed metal lines featuring varying sub-line segment widths and angles, along with connection parts and chamfers, to optimize optical transmittance and prevent metal accumulation at intersections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If micro-nano processing technology is used to reduce line width to 5 μm or less, then optical transparency is improved, but metal accumulation occurs at intersections reducing transparency

Engineering Contradiction:

Improveoptical transparencyVSAvoidmetal accumulation at intersections

Core Design Contradiction:

Illumination intensityVSObject-generated harmful factors

Solution Approach 1:

The metal lines are divided into multiple sub-line segments that are sequentially connected. Each sub-line segment has optimized dimensions and angles to prevent metal accumulation at intersections while maintaining electrical conductivity and optical transparency of the overall mesh structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the metal mesh have different structural characteristics. The sub-line segments have varying widths, lengths, and angles tailored to local requirements, with optimized connection parts at intersections to prevent metal accumulation while maintaining overall mesh performance

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If line width is reduced to improve transparency, then optical transparency increases, but electrical conductivity decreases

Engineering Contradiction:

Improveoptical transparencyVSAvoidelectrical conductivity

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The patent optimizes multiple parameters including sub-line segment width, length, connection part dimensions, and angles between segments. By carefully adjusting these parameters, the mesh achieves both high optical transparency and adequate electrical conductivity for transparent antenna and RF device applications

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The metal mesh structure acts as a composite material system where the geometric arrangement of sub-line segments and connection parts creates effective electromagnetic wave transmission properties while maintaining electrical conductivity, achieving functionality beyond what simple thin metal lines could provide

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12620698B2Metal mesh, thin film sensor and mask

Publication Date: 2026.05.05 BOE TECHNOLOGY GROUP CO LTD

AI summary

A metal mesh includes: first metal lines (11) and second metal lines (12) extending in crossed directions. The first metal lines (11) are arranged side by side in a first direction and extend in a second direction; the second metal lines (12) are arranged side by side in the first direction and extend in a third direction. Each first metal line (11) includes first sub-line segments sequentially connected together in the second direction, and each second metal line (12) includes second sub-line segments sequentially connected together in the third direction. Each first sub-line segment has a midpoint superposing with a midpoint of one of the second sub-line segments, the first and second sub-line segments having superposed midpoints form a crossed structure (10), and define two opposite first angles (θ1) and two opposite second angles (θ2). Each first angle (θ1) is not greater than each second angle (θ1).