Metal Mesh Touch Panel X-Shaped Patterns Driver Compatibility

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing capacitive touch panels using indium tin oxide (ITO) are expensive due to indium scarcity and wastage during production, and the metal-mesh-type touch panels are not compatible with market-available touch driver chips, limiting their application.

Innovation Solution

A touch panel with a novel metal mesh conductive layer featuring X-shaped conductive patterns and structures that can be adjusted in size and shape to match the capacitance of different touch driver chips and display panels, using conductive wires with varying lengths and angles to form meshes, improving compatibility and reducing production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If ITO is applied onto the entire insulating base material and then patterned and etched, then the conductive layer can be formed, but a great quantity of ITO will be wasted and production cost will increase remarkably

Engineering Contradiction:
Improveconductive layer formationVSAvoidITO waste
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent divides the conductive layer into multiple separate conductive patterns (first conductive patterns and second conductive patterns) instead of forming a continuous ITO layer. This segmentation allows precise placement of conductive material only where needed, eliminating waste from patterning and etching processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces expensive ITO material with a more cost-effective conductive ink or paste that can be directly printed or deposited in the desired pattern. This substitution eliminates the need for costly ITO material and the wasteful patterning process associated with it.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Ease of manufacture

If metal mesh is used instead of ITO to form the conductive layer, then production cost can be reduced, but the touch panel is non-compatible with market-available touch driver chips

Engineering Contradiction:
Improveproduction costVSAvoidcompatibility with touch driver chip
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent adjusts the electrical parameters (such as sheet resistance, capacitance, and conductive pattern geometry) of the metal mesh conductive layer to match the specifications required by market-available touch driver chips. By optimizing these parameters, the patent achieves both cost reduction through metal mesh and compatibility with existing driver chips.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If a single structure metal mesh is used, then the conductive layer can be formed, but the application is limited due to non-compatibility with touch driver chip capacitance

Engineering Contradiction:
Improveconductive layer formationVSAvoidapplication range
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent designs the conductive layer with a flexible multi-pattern structure that can be configured to match different capacitance requirements of various touch driver chips. The conductive layer can serve multiple functions and adapt to different applications by adjusting the pattern configuration, making it universally applicable across different touch panel designs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentEP3229116B1Touch panel and display device
Publication Date: 2020.03.25 BOE TECHNOLOGY GROUP CO LTD
  • EP3229116B1 patent drawingFigure 1~3a
  • EP3229116B1 patent drawingFigure 3b~3d
  • EP3229116B1 patent drawingFigure 4

AI summary

The present disclosure provides a touch panel and a display device. The touch panel includes a glass substrate and a conductive film arranged on the glass substrate. The conductive film includes a base material and a conductive layer arranged on the base material. The conductive layer includes first conductive patterns and second conductive patterns, each of which includes a plurality of meshes formed by conductive wires crossing each other. The first conductive patterns are each of an X-shaped structure and arranged in an array form, and the second conductive patterns are each formed at a region surrounding by the adjacent first conductive patterns, arranged adjacent to and insulated from the first conductive pattern, and arranged in an array form.