Metal Methacrylate Sealing Layer for Moisture Protection
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Solution Overview
Problem
Electronic devices such as OLEDs, LCDs, LEDs, OPV cells, and organic thin film transistors are vulnerable to oxygen and moisture, leading to deterioration and a need for an effective seal to maintain their quality.
Innovation Solution
An organic film forming composition is developed, comprising a metal (meth)acrylate and a curable material, which forms a sealing layer with alternating organic and inorganic films to prevent moisture permeation, utilizing the metal (meth)acrylate's ability to adsorb water molecules through hydrogen bonding or ion-dipole interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing layer is applied to protect electronic devices from moisture and oxygen, then the device reliability is improved, but the complexity of the device structure increases
Solution Approach 1:
The sealing structure is divided into multiple alternating layers of organic material and inorganic material, where each layer performs specific protective functions. The organic layers provide flexibility and adhesion while the inorganic layers provide barrier properties, collectively achieving comprehensive protection without requiring a single complex sealing component.
Solution Approach 2:
The patent employs composite material structure combining organic and inorganic layers to create a sealing system that leverages the complementary properties of both material types. The organic-inorganic composite structure provides enhanced moisture and oxygen barrier performance while maintaining mechanical flexibility, resolving the contradiction between protection effectiveness and structural simplicity.
2Reliability
If the sealing layer uses materials with high moisture-adsorbing ability, then the hygroscopic properties are improved, but the moisture permeation prevention capability may be compromised
Solution Approach 1:
The patent converts the typically harmful moisture adsorption property into a beneficial function by using hygroscopic materials within the sealing structure to actively capture and retain moisture molecules that penetrate the barrier layers. This transforms what would be a degradation mechanism into a protective mechanism that prevents moisture from reaching the electronic device components.
Solution Approach 2:
Different layers in the sealing structure are assigned different functional properties: the inorganic layers provide moisture barrier properties while the organic layers with hygroscopic materials provide moisture adsorption capacity. This local differentiation of material properties allows each layer to perform its specific function optimally without compromising the overall sealing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively prevents moisture ingress, enhances the sealing layer's hygroscopic properties, and improves the durability and performance of electronic devices by maintaining a stable moisture-adsorbing ability.
Implementation Method 1
utilizing the metal (meth)acrylate's ability to adsorb water molecules through hydrogen bonding or ion-dipole interactions
Implementation Method 2
utilizing the metal (meth)acrylate's ability to adsorb water molecules through hydrogen bonding or ion-dipole interactions
Data Source
AI summary
An organic film forming composition having improved hygroscopic properties (e.g., moisture-adsorbing abilities) and an electronic apparatus including a cured product of the organic film forming composition. The organic film forming composition may include a metal (meth)acrylate represented by Formula 1; and a curable material having at least two curable groups selected from the groups represented by Formulae 2A to 2D: