Metal Microparticle Dispersion with Polyester Dispersant for Conductive Substrates
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Solution Overview
Problem
Existing methods for producing electrically conductive substrates using metal microparticles face challenges such as high complexity, the need for photoresists, and reduced productivity due to organic dispersants that hinder electrical conductivity and sintering depth.
Innovation Solution
A metal microparticle dispersion comprising metal microparticles with a polymeric dispersant having a polyester or polyether skeleton, which allows for high dispersibility and easy removal of organic matter during burning, enabling efficient production of electrically conductive substrates with excellent conductivity and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional organic dispersants are used to disperse metal microparticles, then dispersibility is improved, but electrical conductivity and sintering depth deteriorate due to organic matter interference
Solution Approach 1:
The patent changes the chemical composition parameter of the dispersant from conventional organic types to a specific polyester structure with polyol and carboxylic acid components in a defined ratio (0.5-5 parts by mass polyol per 1 part by mass carboxylic acid). This parameter change allows the dispersant to provide adequate dispersibility while being sufficiently volatile to not interfere with electrical conductivity and sintering processes.
Solution Approach 2:
The patent extracts and removes organic matter from the system through a burning step at 200-400°C before sintering. This extraction process eliminates the harmful organic dispersant residues that would otherwise prevent electrical conductivity and proper sintering, while the specific polyester dispersant formulation ensures complete removal without leaving harmful residues.
2Reliability
If burning treatment is performed to remove organic matter, then electrical conductivity is improved, but production complexity and process time increase
Solution Approach 1:
The patent merges the burning step with the sintering process into a single thermal treatment step. By conducting burning at 200-400°C followed immediately by sintering at higher temperatures (800-1200°C) without separate processing steps, the patent eliminates process complexity while maintaining electrical conductivity through complete organic matter removal.
Solution Approach 2:
The patent optimizes the burning temperature parameter to 200-400°C, which is sufficient to completely decompose and remove the specific polyester dispersant formulation. This parameter change allows organic matter removal at relatively low temperatures, reducing the overall thermal processing complexity and energy consumption while ensuring complete dispersant elimination for subsequent sintering.
3Loss of substance
If high burning temperature is used to remove organic matter, then dispersant removal is improved, but base material damage occurs through deformation and decoloration
Solution Approach 1:
The patent changes the burning temperature parameter to a controlled range of 200-400°C, which is optimized for complete decomposition and removal of the specific polyester dispersant formulation. This parameter change ensures thorough organic matter elimination while maintaining temperatures below the degradation point of common base materials, preventing deformation and decoloration.
Solution Approach 2:
The patent applies localized thermal treatment where the burning step is performed at 200-400°C specifically targeted at the coating layer containing the dispersant and metal microparticles. This local quality approach ensures complete dispersant removal from the coating while the base material remains unaffected at temperatures below its thermal degradation threshold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in electrically conductive substrates with improved conductivity and adhesive properties, simplifying the production process by eliminating the need for separate burning steps and enhancing productivity.
Implementation Method 1
a metal microparticle dispersion comprising metal microparticles with a polymeric dispersant having a polyester or polyether skeleton
Implementation Method 2
the printed layer is subjected to burning treatment to form a pattern-like metal microparticle sintered film
Implementation Method 3
subjected to burning treatment to form a pattern-like metal microparticle sintered film
Data Source
AI summary
Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.