Metal Microsieve Aperture Design for Submicron Precision
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Solution Overview
Problem
Conventional electroforming techniques are inadequate for producing metal microsieves with apertures in the micron or submicron range due to inaccuracies in photoresist distribution and metal thickness, failing to achieve the required precision for sieve apertures.
Innovation Solution
The development of metal sieve material with apertures that have inlets and outlets connected by passages in the plane of the material parallel to a main surface, allowing for precise control of aperture height and mechanical strength, using a method involving sacrificial layers and electroforming to produce sieve materials with uniform passage heights in the submicron range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroforming techniques are used to produce metal microsieves, then the production process is simple and cost-effective, but the manufacturing precision of aperture dimensions cannot achieve the required accuracy in the micron or submicron range
Solution Approach 1:
The production process is divided into multiple sequential electroforming steps, each creating a specific layer (first metal layer, second metal layer) with controlled properties. This segmentation allows precise control over aperture dimensions at each stage, achieving micron or submicron accuracy that cannot be obtained in a single electroforming operation.
Solution Approach 2:
A sacrificial layer is applied to the growing surface before the second electroforming step. This preliminary action creates a template that defines the passage geometry, ensuring that the subsequent metal layer forms passages with precise dimensions. The sacrificial layer is later removed to reveal the accurately formed apertures.
2Strength
If through apertures extending in a straight line are used, then the structure is simple, but the mechanical strength cannot be enhanced without compromising aperture precision
Solution Approach 1:
The passage structure extends not only through the thickness of the sieve material but also laterally within the plane of the material. This three-dimensional passage configuration (combining vertical and lateral dimensions) enhances mechanical strength by distributing stress more effectively, while the electroforming process maintains precise aperture dimensions throughout the complex geometry.
Solution Approach 2:
The sieve material comprises multiple metal layers deposited in sequence, forming a composite structure. The first metal layer provides structural support, while the second metal layer forms the aperture-defining passages. This composite construction enhances overall mechanical strength while maintaining aperture precision through controlled deposition parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of metal microsieves with precise aperture dimensions and enhanced mechanical strength, suitable for applications requiring high accuracy and durability, such as filtration and separation processes, while offering advantages in handling compounds with dipole moments.
Implementation Method 1
Conventional electroforming techniques for producing sieves for use in screen printing technology are not adequate for the production of such metal microsieves
Data Source
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AI summary
The invention provides a substantially flat sieve material (50) of metal with sieve apertures (52), in particular sieve apertures with microdimensions. The sieve apertures (52) comprise at least one passage (56) in the plane of the sieve material parallel to a main surface (58), while the inlet and outlet (54; 60) can open onto the same main surface or a different main surface. The invention furthermore provides a method for the production of such sieve material by means of electroforming techniques in which a sacrificial material is used.