Metal Inverse Opal Substrate Jet Cooling Thermal Management
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Solution Overview
Problem
Conventional cooling structures for electronic modules are inadequate in managing high heat flux and thermally-induced stresses due to coefficient of thermal expansion mismatches, and they require additional bonding layers that increase thermal resistance.
Innovation Solution
A metal inverse opal substrate with integrated jet cooling, featuring a thermal compensation base layer and a cap layer with orifices and posts, allowing for direct impingement of cooling fluid on the electronic device, thereby enhancing heat removal and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat sinks are used to remove heat, then heat removal is provided, but additional bonding layers and thermal matching materials are required which add substantial thermal resistance
Solution Approach 1:
The patent merges the substrate and heat sink into a single integrated component. The metal inverse opal substrate inherently provides both mechanical support and thermal management functions through its porous structure, eliminating the need for separate bonding layers and thermal interface materials between the electronic device and cooling system.
Solution Approach 2:
The metal inverse opal substrate serves multiple functions simultaneously: it acts as the mechanical substrate for mounting electronic devices, provides thermal conduction pathways through its metal structure, and enables direct liquid cooling through integrated channels. This multi-functionality eliminates the need for additional specialized components.
2Strength
If bonding layers are used to join electronic devices to substrates, then mechanical bonding is achieved, but thermal resistance increases substantially
Solution Approach 1:
The patent removes the intermediate bonding layers from the assembly by enabling direct attachment of electronic devices to the metal inverse opal substrate. The substrate's surface is designed to accept direct bonding or mounting of devices, eliminating the thermal barrier created by multiple intermediate layers.
Solution Approach 2:
The metal inverse opal substrate utilizes a composite porous metal structure that combines the mechanical properties needed for substrate support with high thermal conductivity pathways. This composite structure allows direct thermal contact with mounted devices without requiring thermally-conductive bonding materials.
3Temperature
If additional thermal matching materials are used to manage heat, then thermal management is provided, but the overall assembly complexity increases
Solution Approach 1:
The patent combines thermal management functionality directly into the substrate structure through integrated cooling channels formed within the metal inverse opal. This eliminates the need for separate thermal interface materials, heat spreaders, and matching layers that would otherwise be required to achieve effective thermal management.
4Loss of energy
If conventional cooling structures are used, then cooling is provided, but they are unable to adequately remove sufficient heat to effectively lower operating temperatures
Solution Approach 1:
The metal inverse opal substrate utilizes its porous structure to provide extensive internal surface area and integrated cooling channels. This porous architecture enables high surface-area-to-volume ratio for heat transfer and allows cooling fluid to flow through the substrate, significantly enhancing heat removal capability compared to conventional solid heat sinks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermally-induced stresses and improves heat removal efficiency by positioning the cooling fluid close to the electronic device without intervening components, maintaining the device within acceptable temperature ranges.
Implementation Method 1
A plurality of orifices extends through the thermal compensation base layer between an inlet face and an outlet face positioned opposite to the inlet face, defining a plurality of jet paths
Implementation Method 2
A metal inverse opal substrate with integrated jet cooling... effectively manages thermally-induced stresses and improves heat removal efficiency
Data Source
AI summary
Embodiments of the disclosure relate to an MIO substrate with integrated jet cooling for electronic modules and a method of forming the same. In one embodiment, a substrate for an electronic module includes a thermal compensation base layer having an MIO structure and a cap layer overgrown on the MIO structure. A plurality of orifices extends through the thermal compensation base layer between an inlet face and an outlet face positioned opposite to the inlet face, defining a plurality of jet paths. A plurality of integrated posts extends outward from the cap layer, wherein each integrated post of the plurality of integrated posts is positioned on the outlet face between each orifice of the plurality of orifices.