Metal Oxide Film Structure for Low-Vacancy Crystallinity

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Solution Overview

Problem

Current semiconductor devices using metal oxide films lack stability and reliability due to the presence of amorphous structures and high oxygen vacancies, which affect the electric characteristics and crystallinity.

Innovation Solution

A metal oxide film with a unique structure featuring minute crystal parts and random surface orientations is formed using a sputtering method at room temperature in an oxygen-rich atmosphere, reducing oxygen vacancies and enhancing physical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If an amorphous oxide semiconductor film is used, then the manufacturing process is simple, but the device reliability and electric characteristics are poor due to high oxygen vacancies

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoiddevice reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the crystalline state parameter of the oxide semiconductor from amorphous to c-axis aligned crystalline structure. This parameter change reduces oxygen vacancies and improves electric characteristics while maintaining manufacturing feasibility through sputtering method with specific conditions (oxygen atmosphere, substrate temperature control).

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure with a c-axis aligned crystalline oxide semiconductor film layer over an amorphous oxide semiconductor layer. This composite structure combines the manufacturing simplicity of amorphous materials with the superior electrical properties of crystalline materials, achieving both ease of manufacture and high reliability.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a c-axis aligned crystalline oxide semiconductor film is formed, then the electric characteristics and reliability are improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveelectric characteristicsVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent optimizes sputtering parameters including oxygen atmosphere composition, substrate temperature, and power conditions to achieve c-axis alignment. By controlling these parameters, the patent forms the desired crystalline structure through a relatively simple single-step sputtering process, avoiding the need for complex multi-step manufacturing procedures.

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If oxygen vacancies are reduced in the metal oxide film, then the physical stability is enhanced, but additional processing steps are required

Engineering Contradiction:
Improvephysical stabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The patent performs preliminary oxygen introduction during the sputtering deposition process itself, rather than requiring separate post-processing steps. By controlling the sputtering atmosphere to be oxygen-rich and adjusting deposition conditions, oxygen vacancies are prevented from forming in the first place, achieving both high physical stability and manufacturing efficiency.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting metal oxide film provides highly stable physical properties and improves the reliability of semiconductor devices by minimizing oxygen vacancies and maintaining crystallinity, leading to improved electric characteristics.

Implementation Method 1

A metal oxide film with a unique structure featuring minute crystal parts and random surface orientations is formed using a sputtering method at room temperature in an oxygen-rich atmosphere

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS11978742B2Metal oxide film and method for forming metal oxide film
Publication Date: 2024.05.07 SEMICON ENERGY LAB CO LTD
  • US11978742B2 patent drawing
  • US11978742B2 patent drawing
  • US11978742B2 patent drawing

AI summary

A metal oxide film including a crystal part and having highly stable physical properties is provided. The size of the crystal part is less than or equal to 10 nm, which allows the observation of circumferentially arranged spots in a nanobeam electron diffraction pattern of the cross section of the metal oxide film when the measurement area is greater than or equal to 5 nmφ and less than or equal to 10 nmφ.