Metal Oxide Thin Film Patterning via Nanoimprint
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current nanoimprint technologies for forming metal oxide thin films are complex and require photosensitive prepolymer resins, which complicate the patterning process and limit the efficiency of forming fine patterns for next-generation semiconductor and LED devices.
Innovation Solution
A method using a photosensitive metal-organic material precursor solution is applied directly to a substrate, where it is patterned using ultraviolet or thermal nanoimprinting without a prepolymer resin, allowing for direct patterning of metal oxide thin films and the formation of photonic crystal layers in LED devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photosensitive prepolymer resin is used in the nanoimprint process for forming metal oxide thin films, then the pattern transfer can be achieved, but the process becomes complicated and requires additional etching steps
Solution Approach 1:
The invention extracts and removes the photosensitive prepolymer resin layer from the nanoimprint process, using only the metal organic precursor coating layer for patterning. This eliminates the need for separate etching steps while maintaining pattern transfer accuracy, as the metal organic precursor itself serves as both the coating material and the patterned structure.
Solution Approach 2:
The invention merges the functions of the prepolymer resin and metal organic precursor into a single step. The metal organic precursor coating layer performs both the role of the resist material and the metal oxide source, combining what were previously separate process steps into one integrated approach.
2Manufacturing precision
If a photosensitive prepolymer resin is used in the nanoimprint process, then pattern formation is possible, but the processing time increases
Solution Approach 1:
By removing the prepolymer resin step entirely and using only the metal organic precursor layer for patterning, the invention eliminates the time required for resin coating, curing, and subsequent etching operations, significantly reducing total processing time while maintaining pattern formation capability.
3Manufacturing precision
If physical etching is used to remove residual thickness after nanoimprint filling, then uniform pattern size is achieved, but the process becomes more complex
Solution Approach 1:
The invention removes the physical etching step by using the metal organic precursor directly as the patterned material. The precursor decomposes and forms the final metal oxide pattern without requiring additional etching operations, thereby achieving pattern size uniformity through the decomposition process rather than post-pattern etching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the process, reduces processing time, and improves light emitting characteristics by directly forming high-quality metal oxide thin films and photonic crystal structures, enhancing the light extraction efficiency of LED devices.
Implementation Method 1
irradiating ultraviolet rays to the mold or heating it to cure
Implementation Method 2
irradiating ultraviolet rays to the mold or heating it to cure
Implementation Method 3
applying pressure to a mold having a nanosize
Implementation Method 4
the resin is filled in the pattern by a capillary force
Data Source
Figure 1
Figure 2(a)~2(e)
Figure 3(a)~3(d)
AI summary
Disclosed is a patterning method of a metal oxide thin film using nanoimprinting, and a manufacturing method of a light emitting diode (LED). The method for forming a metal oxide thin film pattern using nanoimprinting includes: coating a photosensitive metal-organic material precursor solution on a substrate; preparing a mold patterned to have a protrusion and depression structure; pressurizing the photosensitive metal-organic material precursor coating layer with the patterned mold; forming a cured metal oxide thin film pattern by heating the pressurized photosensitive metal-organic material precursor coating layer or by irradiating ultraviolet rays to the pressurized photosensitive metal-organic material precursor coating layer while being heated; and removing the patterned mold from the metal oxide thin film pattern, and selectively further includes annealing the metal oxide thin film pattern. Within this, there is provided a method for forming a metal dioxe thin film pattern using nano imprinting, which makes it possible to simplify the process for forming the pattern since the process of separately applying the ultraviolet resin to be used as the resist can be omitted, and forms a micro/nano composite pattern through a single imprint process.