Metal Fine Particle Dispersion for Low-Temperature Resin Substrates
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Solution Overview
Problem
Existing methods for forming fine metal patterns on base materials face challenges such as nozzle clogging in ink-jet methods, increased steps and costs in photolithography, and inadequate bonding strength between metal patterns and soft substrates, which hinder the formation of high-efficiency, low-temperature metal patterns with sufficient durability.
Innovation Solution
A method involving a fluorine-containing resin layer on the base material, where a functional group is formed on the pattern section, and a dispersion liquid with metal fine particles protected by an amine and fatty acid is applied, allowing for selective bonding and self-sintering at low temperatures to create a stable metal pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If ITO is used as transparent electrode material, then transparency is maintained, but resistance value increases with panel size making it unsuitable for large panels
Solution Approach 1:
The invention changes the material parameter from ITO (transparent but high resistance) to metal fine particles (opaque but low resistance). By controlling particle size, thickness, and forming conditions, the patent achieves low resistance values suitable for large panels while managing transparency requirements through precise parameter optimization.
2Weight of moving object
If ITO electrode formation is performed on resin substrate, then weight reduction is achieved, but firing temperature of 300°C cannot be endured by resin substrate
Solution Approach 1:
The invention changes the processing temperature parameter from 300°C (required for ITO firing) to low temperature processing (suitable for resin substrates). This is achieved by using metal fine particles that can be sintered at lower temperatures, enabling weight reduction through resin substrate usage without exceeding substrate temperature limits.
3Ease of manufacture
If ink-jet method is used to form metal pattern, then pattern formation is achieved, but nozzle clogging occurs due to liquid containing electrically conductive particles
Solution Approach 1:
The invention extracts the harmful conductive particles from the ink-jet nozzle interior by using a unique two-stage process: first forming a resist pattern, then applying metal fine particle dispersion liquid. This prevents particle accumulation and clogging in the nozzle while still achieving precise pattern formation through the resist mask.
Solution Approach 2:
The invention performs preliminary action by forming a resist pattern before applying the metal fine particle dispersion liquid. This preliminary resist layer acts as a mask that guides metal particle deposition and prevents nozzle clogging, enabling reliable pattern formation without direct ink-jet deposition of conductive particles.
4Manufacturing precision
If photolithography method is used to form metal pattern, then precise pattern formation is achieved, but number of steps increases leading to higher cost
Solution Approach 1:
The invention merges the resist formation and metal pattern formation steps into a combined process. By using a resist pattern as a mask for metal fine particle deposition, the patent combines what would traditionally be separate photolithography and metal deposition steps, reducing overall process complexity while maintaining precision.
5Weight of moving object
If metal fine particles are applied to soft substrate, then weight reduction and flexibility are achieved, but bonding strength between metal pattern and substrate is insufficient
Solution Approach 1:
The invention performs preliminary action by forming a resist pattern on the soft substrate before applying metal fine particles. This preliminary resist layer provides a stable bonding interface between the substrate and metal particles, ensuring sufficient bonding strength while maintaining the benefits of soft, lightweight substrate material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently forms highly fine metal patterns with low resistance values, suitable for use as electrodes and wiring, and can be applied to transparent substrates, offering improved bonding strength and reduced processing steps compared to traditional techniques.
Implementation Method 1
a base material having a fluorine-containing resin layer on a surface including at least the pattern formation section
Implementation Method 2
forming a functional group on a pattern formation section of the fluorine-containing resin layer... fixing the metal fine particles on the pattern formation section
Implementation Method 3
metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent
Implementation Method 4
By performing heating at relatively low temperature after the application, the metal can be aggregated and sintered to form a metal film
Data Source
AI summary
The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.