Metal-Particle TIM Package Structure for Low-Cost Heat Dissipation
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Solution Overview
Problem
Conventional polymeric thermal interface materials (TIM) used in electronic devices have low thermal conductivity, leading to inadequate heat dissipation and increased manufacturing costs due to the use of expensive metals like gold in intermediate layers.
Innovation Solution
An electronic package design incorporating a metallic thermal interface material (TIM) with metal particles and adhesive layers containing metal particles, which enhance thermal conductivity and reduce manufacturing costs by eliminating the need for gold in intermediate layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymeric thermal interface material is used, then manufacturing cost is reduced, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses composite materials by combining polymeric adhesive with metal particles (such as aluminum, copper, or nickel) to create a thermal interface material that exhibits both adhesive properties and high thermal conductivity. This composite structure allows the material to function as both bonding agent and thermal conductor, resolving the contradiction between low cost and high thermal performance.
Solution Approach 2:
The patent changes the physical and chemical parameters of the adhesive layer by incorporating metal particles with specific thermal conductivities, particle sizes, and concentrations. By adjusting these parameters, the thermal conductivity of the adhesive layer can be optimized to match or exceed that of traditional metallic TIMs while maintaining the cost advantages of polymeric materials.
2Temperature
If metallic thermal interface material is used, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive metallic thermal interface materials with a cost-effective polymeric adhesive containing metal particles. This substitution uses cheaper materials (polymer matrix with dispersed metal particles) to achieve comparable thermal performance, significantly reducing manufacturing costs while maintaining high thermal conductivity.
Solution Approach 2:
By creating a composite material system where metal particles are dispersed in a polymeric matrix, the patent achieves high thermal conductivity at a fraction of the cost of solid metallic TIMs. The composite structure allows optimization of thermal pathways through the metal particles while the polymeric matrix provides cost benefits and adhesive functionality.
3Reliability
If gold is used in intermediate layers, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces gold with alternative materials such as copper, aluminum, or nickel particles embedded in the adhesive layer. These alternative materials provide sufficient electrical and thermal conductivity for reliable connections at a much lower cost, eliminating the need for expensive gold while maintaining connection reliability through the metal particle-enhanced adhesive.
Solution Approach 2:
The patent changes the material composition parameters of the intermediate layer by substituting gold with cost-effective metal particles in polymeric adhesive. By adjusting particle type, size, and concentration, the electrical and thermal conductivity parameters are optimized to maintain reliable connections without using expensive gold materials.
4Temperature
If adhesive layer with metal particles is used, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of adhesive layer and thermal interface material by incorporating metal particles directly into the polymeric adhesive. This consolidation eliminates the need for separate adhesive and TIM layers, simplifying the manufacturing process while achieving high thermal conductivity through the metal particle-enhanced composite material.
Solution Approach 2:
By creating a composite adhesive material that inherently provides both bonding and thermal conduction functions, the patent simplifies manufacturing compared to traditional multi-layer approaches. The metal particles are mixed into the polymeric adhesive during manufacturing, creating a single-material solution that performs multiple functions without increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation and reliability of connections while reducing manufacturing costs through the use of metal particles in adhesive layers, providing strong bonding and adhesion without gold, thus simplifying the manufacturing process.
Implementation Method 1
the thermal conductivity of the polymeric TIM is lower than that of a metal material
Implementation Method 2
an adhesive layer between the electronic component and the thermal conductive element
Implementation Method 3
an intermetallic compound (IMC) between the first metal and the second metal
Data Source
AI summary
An electronic package is provided in the present disclosure. The electronic package comprises: an electronic component; a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal; an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal; and an intermetallic compound (IMC) between the first metal and the second metal.