Metal Partition Wall for Semiconductor Moisture and Light Shielding
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Solution Overview
Problem
Conventional semiconductor devices with photoreceptor and circuit parts on the same substrate face issues of moisture absorption by interlayer insulation films, leading to wiring deterioration and noise generation due to exposed interlayer insulation films in the open portion, which affects the operation of the circuit part.
Innovation Solution
A partition wall composed of a metal material is formed within the wiring structure layer adjacent to the open portion, separating the photoreceptor and circuit parts and preventing moisture and light penetration into the circuit part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the wiring structure layer is opened in the photoreceptor part to improve light incident amount, then photoelectric conversion efficiency is improved, but interlayer insulation films become exposed and absorb moisture leading to wiring deterioration and noise generation
Solution Approach 1:
The wiring structure layer is divided into two regions: an open part above the photoreceptor part for light incident and a closed part above the circuit part for protection. This segmentation allows the open part to maximize light incident amount for photoelectric conversion while the closed part protects interlayer insulation films from moisture absorption, thus resolving the contradiction between photoelectric conversion efficiency and wiring reliability
Solution Approach 2:
A light-shielding film is introduced as an intermediary element to close the wiring structure layer above the circuit part. This light-shielding film acts as a mediator that prevents moisture from reaching exposed interlayer insulation films while maintaining the open structure above the photoreceptor part, thereby protecting wiring reliability without compromising photoelectric conversion efficiency
2Use of energy by moving object
If the wiring structure layer is opened in the photoreceptor part to improve light incident amount, then photoelectric conversion efficiency is improved, but light penetrates into the circuit part causing noise generation
Solution Approach 1:
The wiring structure layer is segmented into open and closed regions, with the closed part positioned above the circuit part to block light penetration. This segmentation allows light to reach the photoreceptor part efficiently while preventing stray light from entering the circuit part, thus eliminating noise generation while maintaining photoelectric conversion efficiency
Solution Approach 2:
The light-shielding film serves as an intermediary barrier that selectively blocks light from reaching the circuit part while allowing light to incident on the photoreceptor part. This mediator prevents the harmful effect of light-induced noise in the circuit part without compromising the photoelectric conversion process
3Use of energy by moving object
If the wiring structure layer is opened in the photoreceptor part to improve light incident amount, then photoelectric conversion efficiency is improved, but manufacturing complexity increases due to additional light-shielding film formation
Solution Approach 1:
The light-shielding film is merged with the wiring structure layer formation process, utilizing the same interlayer insulation film deposition and patterning steps. This merging approach adds minimal manufacturing complexity while achieving the dual benefits of improved light incident amount and protected interlayer insulation films
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses fluctuations in circuit characteristics, wiring deterioration, and noise generation by blocking moisture and light, thereby enhancing the reliability of the semiconductor device.
Implementation Method 1
a partition wall composed of a metal material which is formed within the wiring structure layer adjacent to the open portion, along a boundary of the photoreceptor portion with the circuit portion
Implementation Method 2
a partition wall composed of a metal material which is formed within the wiring structure layer adjacent to the open portion, along a boundary of the photoreceptor portion with the circuit portion
Implementation Method 3
a laser light is radiated along a track of the optical disk, and the reflected light is detected. The recorded data are retrieved based on variation of the reflected light intensity
Data Source
AI summary
An open portion is provided to an interlayer insulation film so as to correspond to a photoreceptor part of an optical detection device. A partition wall for surrounding the open portion (120) is formed by a metal material inside a wiring structure layer (90) along the boundary between the photoreceptor part (4) and a circuit part (6). The partition wall is formed by a contact structure having a multi-level structure with respect to a separation region (74) disposed on the external periphery of the photoreceptor part (4). The partition wall prevents moisture absorption and light penetration from the wall surface of the open portion, and suppresses wiring degradation or fluctuation of the characteristics of the circuit elements on the periphery of the photoreceptor part.