Metal Paste Bonding Temperature Control
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Solution Overview
Problem
The existing method of bonding a substrate with a conductor pattern and a semiconductor element using a metal particle paste results in a sintering reaction before pressure is applied, leading to a lack of high bonding strength between the substrate and the semiconductor element.
Innovation Solution
A method involving the formation of an assembled body with a metal particle paste interposed between the substrate and the semiconductor element, where the assembled body is arranged between two heating plates, and bonding is performed by heating while applying pressure, with the temperature at the start of pressure application maintained between 0°C to 150°C to minimize sintering reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is transferred to the metal particle paste before pressure is applied, then the sintering reaction occurs in a portion of the metal particle paste, but the bonding strength between substrate and semiconductor element decreases
Solution Approach 1:
The patent applies preliminary action by pre-heating the heating plates to the target temperature before placing the assembled body on them. This ensures that when pressure is applied, the metal particle paste is at the optimal temperature for sintering, preventing premature sintering that would occur if heat transfer happened during the bonding process. The heating plates are prepared in advance to maintain consistent thermal conditions throughout the bonding operation.
2Strength
If pressure is applied immediately without pre-heating, then sintering reaction is minimized, but the bonding process time increases
Solution Approach 1:
The patent resolves this time-strength contradiction by performing preliminary heating of the heating plates before the bonding process. This pre-heating action eliminates the need for prolonged heating during bonding, as the thermal energy is already available when the assembled body is placed on the plates. Consequently, the metal particle paste reaches optimal sintering temperature quickly, maintaining high bonding strength without excessive process time.
3Productivity
If the assembled body is placed on pre-heated plates, then heating efficiency increases, but temperature control precision decreases due to heat transfer before pressure application
Solution Approach 1:
The patent maintains both high heating efficiency and temperature control precision through preliminary heating of the plates combined with controlled timing. The heating plates are pre-heated to the exact target temperature, and the assembled body is placed on them only when ready for bonding. This approach ensures rapid heat transfer (high efficiency) while preventing premature sintering (maintaining precision) by coordinating the timing of placement with the bonding initiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a higher bonding strength between the substrate and the semiconductor element by minimizing sintering reactions, while avoiding prolonged heating times that could reduce productivity.
Implementation Method 1
bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body
Implementation Method 2
a sintering reaction (solidifying reaction) occurs in a portion of the metal particle paste
Data Source
AI summary
Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0° C. to 150° C. In the bonding step, a metal particle paste minimally generates a sintering reaction.