Metal Paste Sintering with Peroxide Agents for Low-Temperature Joining
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Solution Overview
Problem
Conventional sintering methods for joining sensitive components in power electronics require high processing temperatures and pressures, which can damage the components and result in inadequate heat and electrical conductivity, and there is a need to lower the processing temperature further to enhance component quality and reduce energy costs.
Innovation Solution
A sintering method using a metal paste with coated metal particles, where the coating is removed by sintering agents like organic peroxides, inorganic peroxides, and inorganic acids at temperatures below 200°C, allowing for the formation of low-porosity, high-conductivity contact points between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sintering methods are used to join components, then stable joining is achieved, but high processing temperature and pressure damage the components
Solution Approach 1:
The patent changes the chemical composition parameters of the metal paste by incorporating organic peroxides, inorganic peroxides, and inorganic acids as sintering agents. These additives enable the sintering process to occur at lower temperatures (below 200°C) and pressures (below 3 bar) by providing alternative chemical mechanisms for metal particle bonding, thus resolving the contradiction between joining stability and component damage from high temperature/pressure
Solution Approach 2:
The patent introduces sintering agents (organic peroxides, inorganic peroxides, and inorganic acids) as intermediary substances that facilitate the sintering process. These intermediaries decompose at low temperatures to generate oxygen and metal oxides that promote metal particle bonding without requiring high temperature and pressure, thereby enabling stable joining while protecting sensitive components from thermal and mechanical stress
2Object-affected harmful factors
If processing temperature is reduced to protect components, then component quality improves, but contact points exhibit high porosity and inadequate conductivity
Solution Approach 1:
The patent modifies the chemical parameters of the sintering process by using peroxide-based sintering agents that decompose to provide oxygen and metal oxides. This chemical parameter change enables effective metal particle bonding and porosity reduction at temperatures below 200°C, maintaining both component protection and high contact point conductivity
Solution Approach 2:
The patent creates a composite metal paste system combining metal particles with peroxide sintering agents and organic compounds. This composite formulation allows the sintering process to proceed through multiple mechanisms (oxidation, decomposition, and metal particle fusion) at low temperatures, achieving low porosity and high conductivity without compromising component quality
3Manufacturing precision
If high processing temperature is used to achieve low porosity, then contact point conductivity improves, but energy consumption increases
Solution Approach 1:
The patent changes the thermal and chemical parameters of the sintering process by incorporating peroxide-based sintering agents. These agents decompose exothermically at low temperatures to provide the necessary energy and chemical environment for dense metal particle bonding, achieving low porosity at temperatures below 200°C and significantly reducing energy consumption compared to conventional high-temperature sintering
Solution Approach 2:
The patent converts the typically harmful effect of organic compound decomposition (which usually requires high temperature) into a beneficial process. The organic compounds in the metal paste decompose at low temperatures in the presence of peroxide sintering agents, providing the necessary chemical reactions and energy for sintering while reducing overall energy consumption and achieving low porosity contact points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables stable, low-porosity, and high-conductivity contact points between components at reduced temperatures, improving the quality of power electronics while minimizing component stress and energy consumption.
Implementation Method 1
the coating is removed by sintering agents like organic peroxides, inorganic peroxides, and inorganic acids at temperatures below 200°C
Implementation Method 2
the sandwich arrangement is sintered, characterized in that the metal paste comprises (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound
Data Source
AI summary
A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.