Metal Pattern Film With Oxide Adhesion Layers for Clean Peeling
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Solution Overview
Problem
Existing metal pattern films experience a stick-slip phenomenon during peeling, leading to wrinkles and stains, making reprocessing impossible.
Innovation Solution
A metal pattern film with ultra-thin inorganic oxide adhesion promoting layers on both surfaces of the substrate, formed via e-beam sputter equipment, enhances adhesive strength and prevents stick-slip by reducing vibrations during peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If a conventional metal pattern film is peeled off, then the functional film can be reused, but a stick-slip phenomenon occurs causing wrinkles and stains
Solution Approach 1:
An ultra-thin inorganic oxide layer (0.1-30 nm) is introduced as an intermediary between the substrate and adhesive layer. This layer acts as a mediator that reduces the stick-slip phenomenon during peeling, allowing the functional film to be peeled off without wrinkles or stains while maintaining adhesion strength
Solution Approach 2:
The thickness of the inorganic oxide layer is precisely controlled within the range of 0.1-30 nm. By optimizing this parameter, the film achieves both strong adhesion and reduced stick-slip phenomenon, enabling clean peeling and reprocessing
2Strength
If an adhesion promoting layer is added to enhance adhesive strength, then bonding between substrate and adhesive layer improves, but film complexity increases
Solution Approach 1:
The inorganic oxide layer thickness is optimized to an ultra-thin range of 0.1-30 nm. This parameter optimization provides sufficient adhesion promotion while minimizing the added complexity and maintaining overall film simplicity
Solution Approach 2:
The film structure combines the substrate, ultra-thin inorganic oxide layer, and adhesive layer into a composite structure. This composite design enhances adhesive strength through the oxide layer while maintaining overall structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film maintains adhesive strength and transparency, allowing for reprocessing without wrinkles or stains, and improves adhesiveness between the substrate and pattern layer.
Implementation Method 1
the first and second adhesion promoting layers are formed on the substrate by a vapor deposition process using e-beam sputter equipment
Implementation Method 2
the first and second adhesion promoting layers are formed on the substrate by a vapor deposition process using e-beam sputter equipment
Data Source
Figure 1~2
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AI summary
The present application relates to a metal pattern film comprising a substrate; a first adhesion promoting layer and a second adhesion promoting layer each provided on both surfaces of the substrate; a metal pattern provided on a surface opposite to the surface adjoining the substrate of the first adhesion promoting layer; a first adhesive layer provided on the surface provided with the metal pattern of the first adhesion promoting layer so as to cover the metal pattern; and a second adhesive layer provided on a surface opposite to the surface adjoining the substrate of the second adhesion promoting layer, wherein the first adhesion promoting layer and the second adhesion promoting layer comprise an inorganic oxide, and a method for preparing the same.