Pre-packaged Metal-pillar Frame for 3D Package Integration
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Solution Overview
Problem
Semiconductor packaging faces challenges with warping and delamination due to differing thermal expansion coefficients of embedded materials, limiting functional integration and package size reduction.
Innovation Solution
A process involving a pre-packaged metal-pillar frame for interlayer conduction, where a metal sheet is punched or etched to form a conductive frame, packaged with a molding compound, and integrated with a substrate using solder paste or conductive adhesive, allowing for improved interlayer connection and reduced defects like delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are embedded inside a substrate to improve functional integration, then the functional integration level is improved, but the substrate experiences serious warping and delamination due to different thermal expansion coefficients of interlayer materials
Solution Approach 1:
The patent changes the material parameter by replacing traditional organic substrates with a metal-pillar frame structure. This fundamental material parameter change enables the structure to accommodate different thermal expansion coefficients of embedded components without experiencing the warping and delamination problems that plague organic substrates, thus resolving the contradiction between functional integration and substrate stability
Solution Approach 2:
The patent employs a composite structure consisting of a metal frame with embedded pillars and integrated components. This composite architecture combines the mechanical strength and thermal stability of metal with the functional diversity of embedded electronic components, allowing high functional integration while maintaining structural reliability under thermal stress
2Volume of moving object
If the package size is reduced to meet small and light requirements, then the package becomes more compact, but the space for improvement becomes limited and functional integration becomes more difficult
Solution Approach 1:
The patent transitions from planar two-dimensional packaging to three-dimensional vertical integration using a metal-pillar frame structure. This dimensional change allows components to be stacked and integrated in the vertical dimension, achieving high functional integration within a compact volume, thus resolving the contradiction between small package size and functional integration capability
Solution Approach 2:
The patent implements a nested structure where electronic components are embedded within the metal-pillar frame structure. The frame contains pillars that hold components, which are in turn surrounded by molding compound. This nested architecture maximizes functional integration density within a minimal package volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances functional integration, reduces packaging size, and prevents delamination by using a pre-packaged metal-pillar frame for interlayer conduction, improving the reliability and applicability of the three-dimensional package structure.
Implementation Method 1
punching or etching the metal sheet to form a conductive metal-pillar frame
Implementation Method 2
punching or etching the metal sheet to form a conductive metal-pillar frame
Implementation Method 3
printing the conductive metal-pillar frame on the substrate by a solder paste
Implementation Method 4
fitting the conductive metal-pillar frame to the substrate by a conductive adhesive
Data Source
AI summary
The present invention relates to a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: taking a metal sheet; punching or etching the metal sheet; packaging a conductive metal-pillar frame; performing windowing and slotting; taking a substrate on which a chip is surface-mounted; fitting the conductive metal-pillar frame; performing packaging and grinding; surface-mounting a passive device; performing plastic packaging and ball-mounting; and performing cutting. The process of the present invention can improve the integration level and the reliability.