Metal Piping with Deformable Section for Electronic Device Cooling
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Solution Overview
Problem
The existing electronic devices face challenges with low pressure resistance of resin-based flexible tubes used for refrigerant piping, which can lead to damage under increased pressure, and using metal piping to improve resistance complicates assembly and increases device size.
Innovation Solution
The electronic device incorporates metal piping with an inner piping portion between substrates and an outer piping portion that includes a deformable, movable section, allowing for improved pressure resistance and easier assembly while reducing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a resin-based flexible tube is used for refrigerant piping, then ease of assembling is improved, but pressure resistance against refrigerant is lowered
Solution Approach 1:
The piping system uses a composite structure combining resin and metal materials. The resin piping portion provides flexibility and ease of assembly, while the metal piping portion provides high pressure resistance. This composite material approach allows the system to simultaneously achieve both ease of assembling and sufficient pressure resistance that neither material could provide alone.
2Strength
If metal piping is used to improve pressure resistance, then pressure resistance against refrigerant is improved, but device size is increased
Solution Approach 1:
The piping system applies different material properties to different sections based on local requirements. The metal piping portion with high pressure resistance is positioned only where needed (in the heat generation region between substrates), while resin piping is used in other areas. This local quality approach ensures sufficient pressure resistance at critical locations without unnecessarily increasing the overall device size.
Solution Approach 2:
The metal piping portion is inserted within or alongside the resin piping structure, creating a nested configuration. The metal piping is positioned in the inter-substrate region while the resin piping extends outward, allowing the high-strength metal component to be contained within the larger resin piping system, thereby minimizing the overall device footprint.
3Ease of operation
If metal piping is made deformable to improve ease of assembling, then ease of assembling is improved, but distance between substrates is increased
Solution Approach 1:
The piping system is segmented into distinct portions with different properties: a metal piping portion for the inter-substrate region and a resin piping portion for external connections. This segmentation allows each portion to be optimized independently - the metal portion can be deformable for ease of assembly without requiring increased substrate distance, while the resin portion handles the external routing.
Data Source
AI summary
A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.