Metal-Plastic Housing Bonding via Micro Anchored Apertures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for combining metal and plastic members in electronic device housings, such as injection molding, face challenges including prolonged processing times, deformation control issues, and safety hazards due to high mold temperatures.
Innovation Solution
A novel method involving pre-treatment of metal members with micro anchored apertures and controlled temperature injection molding, where the metal member is placed in a mold at a lower temperature and molten plastic is injected at a higher temperature, enhancing structural strength and reducing processing time while ensuring operator safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional injection molding is used to combine metal and plastic members, then the metal member can be embedded in the plastic member, but the mold must be kept at high temperature which causes prolonged processing time and difficulty in controlling product deformation
Solution Approach 1:
The metal member is pre-treated with micro anchored apertures before injection molding. This preliminary surface modification creates mechanical interlocking features that enhance bonding strength without requiring prolonged high-temperature molding, thus resolving the contradiction between achieving strong structural integration and reducing processing time
Solution Approach 2:
The invention changes the surface parameters of the metal member by creating micro anchored apertures, which fundamentally alters how the plastic material bonds to the metal. This parameter change enables effective bonding at lower mold temperatures, reducing processing time while maintaining structural strength
2Strength
If conventional injection molding is used to combine metal and plastic members, then the metal member can be embedded in the plastic member, but the high temperature mold makes it difficult to control product deformation
Solution Approach 1:
By pre-creating micro anchored apertures on the metal member surface, the invention establishes a controlled bonding interface before molding. This preliminary action provides consistent anchoring points that guide plastic flow and reduce random deformation, improving manufacturing precision while maintaining bonding strength
Solution Approach 2:
The micro anchored apertures are created only on the specific bonding surface of the metal member, concentrating the bonding mechanism at the local interface. This local quality enhancement improves bonding strength at the critical interface without requiring high temperatures that would cause overall product deformation
3Ease of manufacture
If high temperature mold is used for injection molding, then the plastic material can be properly molded, but the operator may suffer burn or injury
Solution Approach 1:
The invention changes the bonding mechanism from thermal adhesion to mechanical interlocking through micro anchored apertures. This parameter change allows the mold to operate at lower temperatures that are safe for operators while still achieving proper plastic molding and bonding, thus resolving the contradiction between ease of manufacture and operator safety
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in stronger, lighter, and thinner electronic device housings with improved quality control and reduced processing time, while providing a safer working environment by controlling mold temperatures.
Implementation Method 1
the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for being combined on the surface of the metal member having the micro anchored apertures, in which the plastic injection mold is kept at a second temperature
Data Source
AI summary
A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.