Thermal Insulation in Metal-Polymer Profile Composite Structures

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Solution Overview

Problem

Existing devices for forming structures lack adequate thermal insulation capacity, particularly in maintaining a consistent thermal state within closed structures, as they fail to effectively prevent heat transfer between the inside and outside environments.

Innovation Solution

A device comprising a metal profile and a polymer profile arranged in series, with an insulating component made of a less thermally conductive material than the metal, creating closed chambers that prevent direct contact and enhance insulation by using air or insulating materials within the polymer profile's chamber.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metal profiles are used for forming structure devices, then mechanical strength and structural stability are improved, but thermal insulation capacity deteriorates due to high thermal conductivity

Engineering Contradiction:

Improvemechanical strengthVSAvoidthermal insulation capacity

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

The device combines metal profiles with polymer profiles and insulating components to create a composite structure. The metal profile provides mechanical strength while the polymer profile and insulating component (arranged in series with air gaps) provide thermal insulation, resolving the contradiction between strength and insulation.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The polymer profile and insulating component act as intermediary elements between the metal profile and the external environment. These intermediaries have low thermal conductivity and interrupt direct heat transfer paths, reducing thermal energy loss while maintaining structural integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If direct contact between metal profile and polymer profile is maintained, then structural simplicity is improved, but thermal insulation capacity deteriorates due to direct heat conduction paths

Engineering Contradiction:

Improvestructural simplicityVSAvoidthermal insulation capacity

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The device segments the thermal path by introducing an insulating component with air gaps between the metal profile and polymer profile. This segmentation creates multiple thermal resistance layers, interrupting direct heat conduction while maintaining relatively simple overall structure.

Inventive Principle:

Principle #1Segmentation

3Loss of energy

If insulating components are added between metal and polymer profiles, then thermal insulation capacity is improved, but device complexity increases

Engineering Contradiction:

Improvethermal insulation capacityVSAvoiddevice complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The metal profile, insulating component, and polymer profile are merged into a single integrated device assembly. This combining approach achieves improved thermal insulation while maintaining ease of installation and relatively simple overall device structure, as the components work together as a unified system.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces heat transmission between the inside and outside of the structure, providing effective thermal insulation while maintaining simplicity and compactness, using materials like aluminum for the metal profile and PVC for the polymer profile, which enhances mechanical and thermal properties.

Implementation Method 1

an insulating component arranged between, and in contact with, said at least one first chamber defined by the metal profile and said second chamber defined by the polymer profile, wherein said insulating component forms at least one insulating cavity

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

the polymer profile, arranged in use towards the inside of the structure, has the aforesaid second chamber closed which can be filled with air or possibly filled with insulating material, for the purpose of insulating the chamber

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP4455419A1Device for forming a structure

Publication Date: 2024.10.30 PRO LAM ALLUMINIO

Figure 1A
Figure 1B
Figure 1C

AI summary

Device (1) for forming a structure connectable to at least one wall (11) of the structure, comprising a metal profile (2) and a polymer profile (3), the metal profile (2) defining in section at least one first closed chamber (4), the polymer profile (3) defining in section a second closed chamber (5) and an insulating component (7) arranged between, and into contact with, said first and second chambers (4, 5), wherein said insulating component (7) forms at least one insulating chamber (7a, 7b, 7c), said metal profile (2), insulating component (7) and second closed chamber (5) being arranged in series, so as to prevent contact between the metal profile (2) and the second closed chamber (5) of said polymer profile (3).