Metal Post-Mask ECO for IC Metallization Stack Security
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Solution Overview
Problem
Integrated circuits face challenges in efficiently implementing engineering change orders (ECOs) due to the need for costly and time-consuming changes to mask sets, especially when addressing electromagnetic attacks, as existing methods require modifications to both frontend and backend layers, leading to shipping delays and increased costs.
Innovation Solution
A method is introduced to design a metallization stack with a first grid for power and signal connections and a second grid for electromagnetic attack security, where patterned metal features of the second grid are interspersed with the first grid, allowing for disconnection and reconnection of features to implement ECOs without altering existing via layer masks, thereby reducing costs and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If changes are applied to the backend layers to implement ECOs, then connectivity changes can be made, but mask changes are required which lead to shipping delays and increased costs
Solution Approach 1:
The patent segments the metallization stack into distinct first and second grids with separate functions. The second grid is designed specifically for electromagnetic attack security and can be modified independently through ECOs without requiring changes to the first grid or existing via layer masks, enabling connectivity changes without shipping delays
Solution Approach 2:
The second grid is pre-configured with patterned metal features and vias that can be selectively activated or modified through ECOs. This preliminary structure allows post-manufacturing connectivity changes to be implemented by simply changing the layout design rather than requiring physical mask changes, eliminating shipping delays
2Adaptability or versatility
If changes are applied to the backend layers to implement ECOs, then connectivity changes can be made, but mask changes are required which increase costs
Solution Approach 1:
By segmenting the metallization stack into functionally independent first and second grids, the patent enables ECOs to be implemented by modifying only the second grid layout. This segmentation allows connectivity changes to be made without requiring changes to existing via layer masks or other manufacturing masks, significantly reducing ECO implementation costs
Solution Approach 2:
The second grid is preliminarily designed with a flexible layout structure that accommodates ECOs through layout changes alone. The pre-configured vias and metal features can be reconfigured through ECOs without requiring new mask sets, eliminating the need for costly mask remanufacturing
3Object-affected harmful factors
If a second grid is added for electromagnetic attack security, then security is improved, but device complexity increases
Solution Approach 1:
The patent merges the first grid for power/signal connections and the second grid for electromagnetic attack security into a single integrated metallization stack. Both grids share the same physical substrate and manufacturing process, allowing security enhancement without proportionally increasing overall device complexity
Solution Approach 2:
The metallization stack is designed with universal structures that serve multiple functions. The vias and metal layers are configured to simultaneously support both the first grid's connectivity function and the second grid's security function, reducing the need for separate dedicated structures and minimizing complexity increase
Data Source
AI summary
A method of designing a layout of a metallization stack of an integrated circuit (IC), where the stack includes metal layers having patterned metal features. The method includes determining a layout of a first grid of the metallization stack, including patterned metal features for supplying power and providing signal connections to components of the IC. The method also includes determining a layout of a second grid of the stack for securing the IC against electromagnetic attacks. The second grid includes patterned metal features interspersed with the patterned metal features of the first grid in at least some of the metal layers of the metallization stack. The patterned metal features of the second grid are electrically connected to the first grid. The method further includes determining at least one layout change for the metallization stack in accordance with an engineering change order.