Metal Post Forming on PCB Wiring Layers
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Solution Overview
Problem
The increasing complexity of electronic components in 5G era printed circuit boards requires efficient methods to manufacture metal posts with adjustable height and reduced surface roughness, avoiding quality risks associated with desmearing and plasma processing.
Innovation Solution
Forming metal posts as deep vias using a copper clad laminate core layer before circuit formation, allowing for easy adjustment and integration with wiring layers, eliminating the need for additional processing steps like desmearing or plasma processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If desmearing or plasma processing is performed on the surface of insulating material to form roughness for bonding, then bonding strength between metal post and insulating material is improved, but manufacturing complexity and quality risk increase
Solution Approach 1:
The patent extracts the metal post formation process from the insulating material surface treatment process. Instead of treating the insulating material surface with desmearing or plasma processing, the invention forms metal posts directly on the insulating material using a simplified electroplating process, eliminating the need for complex surface roughness treatment while maintaining bonding strength
Solution Approach 2:
The patent applies preliminary action by forming a seed layer on the insulating material surface before electroplating the metal post. This seed layer preparation in advance enables direct electroplating without requiring subsequent desmearing or plasma processing steps, simplifying the overall manufacturing process while ensuring proper adhesion
2Area of stationary object
If metal post height is increased to reduce pitch for double-sided SiP structure, then area is reduced, but manufacturing precision and quality control become more difficult
Solution Approach 1:
The patent applies dynamics by making the metal post height adjustable through controlled electroplating parameters. The height can be dynamically controlled by adjusting plating time, current density, and electrolyte composition, allowing precise control of metal post dimensions while maintaining manufacturing feasibility and quality consistency
Solution Approach 2:
The patent uses parameter changes in the electroplating process to control metal post height precision. By adjusting electroplating parameters such as current density, plating time, temperature, and electrolyte concentration, the invention achieves precise control over metal post dimensions, enabling height adjustment without compromising manufacturing precision
3Reliability
If additional processing steps like desmearing and plasma processing are added to form metal post, then bonding reliability is improved, but manufacturing time and complexity increase
Solution Approach 1:
The patent merges the metal post formation process with the circuit board manufacturing process. The electroplating step that forms the metal post is integrated into the existing plating line used for other circuit features, combining multiple functions into a single process step and eliminating the need for separate desmearing or plasma processing steps, thereby maintaining bonding reliability while reducing manufacturing time
Data Source
AI summary
A printed circuit board includes a first insulating layer; a first wiring layer having at least a portion buried in one surface side of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer; a metal post disposed on the exposed one surface of at least the portion of the first wiring layer; and a second wiring layer disposed on the other surface of the first insulating layer. A width of a first surface, connected to the exposed one surface of at least a portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.