One-Piece Metal Process Kit Shield for RF-PVD Particle Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In RF-PVD chambers, particles from the target material collect on the ceramic upper portion of the process kit shield and in spaces between the metallic and ceramic components, leading to contamination and defects on the substrate being processed.
Innovation Solution
A one-piece metal body process kit shield with a configured upper portion and lower portion, featuring a gap to limit arcing and particle deposition, and contoured surfaces to prevent particle collection, replaces the traditional ceramic and metallic components to reduce particle contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic upper portion is used in the process kit shield, then arcing between the target and metallic lower portion is prevented, but particle deposition on the ceramic surface and in spaces between components increases
Solution Approach 1:
The patent combines the ceramic upper portion and metallic lower portion into a single integrated process kit shield component. This eliminates the gap between separate components where particles accumulate, while the ceramic material itself continues to provide arc prevention functionality. The merged design removes the interface space that was previously a particle collection zone.
Solution Approach 2:
The patent addresses particle contamination by designing the process kit shield to actively capture and retain particles on its outer surfaces rather than allowing them to migrate to the substrate. The shield becomes a sacrificial element that accumulates particles in controlled locations, protecting the substrate from contamination while maintaining arc prevention capabilities.
2Object-generated harmful factors
If a one-piece metal body is used, then particle deposition is reduced, but the gap for limiting arcing must be maintained
Solution Approach 1:
The patent merges the upper and lower portions into a one-piece metal body structure, eliminating the interface gap that collects particles. The contoured surfaces are designed to prevent particle accumulation while maintaining the necessary electrical isolation for arc prevention through proper spacing and geometry rather than through separate component interfaces.
Solution Approach 2:
The patent applies different surface geometries to different regions of the one-piece metal body. Specific contoured surfaces are designed with particular shapes and angles optimized for particle flow and prevention of deposition in critical areas, while other regions maintain structures necessary for electrical isolation and arc prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces particle formation on the process kit shield during RF-PVD processes while maintaining a sufficient gap to limit arcing, thereby minimizing substrate contamination and defects.
Implementation Method 1
limit particle deposition on an upper surface of the upper portion of the one-piece metal body during sputtering of a target material from the target
Data Source
AI summary
Apparatus for improved particle reduction are provided herein. In some embodiments, an apparatus may include a process kit shield comprising a one-piece metal body having an upper portion and a lower portion and having an opening disposed through the one-piece metal body, wherein the upper portion includes an opening-facing surface configured to be disposed about and spaced apart from a target of a physical vapor deposition chamber and wherein the opening-facing surface is configured to limit particle deposition on an upper surface of the upper portion of the one-piece metal body during sputtering of a target material from the target of the physical vapor deposition chamber.