Electrical Heating Bonding Device for Metal-Resin Joints
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Solution Overview
Problem
Heat welding of metal and resin components faces issues such as deformation of the resin due to radiant heat and surface oxidation of the metal, while existing bonding methods are limited by material constraints.
Innovation Solution
An electrical heating bonding device that uses electrodes to heat the metal component, applies pressure only after reaching a predetermined temperature, and controls the heating and pressure to prevent excessive resin deformation and oxidation, allowing for bonding at a temperature below the resin's melting point.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat welding is used to bond metal and resin members, then bonding strength is improved, but the resin member deforms due to radiant heat and the metal surface oxidizes
Solution Approach 1:
The metal member is heated to the predetermined temperature before the resin member is pressed against it. This preliminary heating action ensures that the metal surface reaches the optimal bonding temperature without exposing the resin to excessive heat that would cause deformation or oxidation.
Solution Approach 2:
The invention changes the temperature parameter from the conventional high-temperature heat welding (resin melting point or higher) to a lower predetermined temperature (50°C to 150°C). This parameter change allows bonding to occur without melting the resin, preventing deformation and oxidation while maintaining bonding strength.
2Strength
If the metal member is heated to high temperature for bonding, then bonding effectiveness is improved, but the metal surface oxidizes
Solution Approach 1:
The invention changes the temperature parameter from high temperature (resin melting point or higher) to a lower predetermined temperature (50°C to 150°C). This prevents metal surface oxidation while maintaining effective bonding through the controlled temperature range.
3Strength
If conventional bonding methods are used, then bonding is achieved, but material selection is extremely limited
Solution Approach 1:
By changing the temperature parameter to a lower predetermined range (50°C to 150°C) and using electrical heating for precise control, the invention enables bonding of various metal and resin material combinations without the extreme temperature constraints of conventional methods, thus expanding material compatibility.
Solution Approach 2:
The invention replaces conventional heat welding mechanisms with electrical heating through electrodes. This substitution provides precise temperature control and eliminates the need for extreme temperatures, enabling broader material compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively bonds metal and resin components without deformation or oxidation, maintaining high strength and rigidity while allowing for a wide range of material combinations.
Implementation Method 1
a plurality of electrodes which sandwich the first member to be bonded, and are electrically conductive with the first member to be bonded
Data Source
AI summary
An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.