Metal-Introduced Resist Film Patterning for High Contrast

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Solution Overview

Problem

Conventional pattern forming methods using photoresists suffer from low contrast, which hinders the formation of fine and high-resolution patterns.

Innovation Solution

Introducing a metal into the resist film between the application of the resist material and the exposure step, using a polymer with specific structural units and metal gas materials to enhance contrast and resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional photoresist method is used, then the process is simple and well-established, but the contrast is low and fine pattern formation is hindered

Engineering Contradiction:

Improvepattern contrastVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by introducing a metal layer into the resist film before the exposure step. This pre-treatment modifies the resist material's properties in advance, enabling higher contrast during subsequent exposure and development, thereby solving the low contrast problem without fundamentally changing the overall process flow

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses composite materials by combining organic resist material with metal elements (such as tungsten, molybdenum, or tantalum) to create a hybrid resist system. This composite structure leverages the advantages of both materials: the organic component provides solubility and processability, while the metal component enhances contrast and enables fine pattern formation

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the resist film contrast is increased by adding metal, then fine pattern resolution is improved, but the process steps increase

Engineering Contradiction:

Improvepattern resolutionVSAvoidprocess efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges the metal introduction step with the existing resist film formation process. Instead of adding completely separate process steps, the metal is introduced during or immediately after the spin-coating process, allowing the metal layer and organic resist to be combined in a single integrated operation, thus improving resolution without proportionally increasing process time

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables the formation of high-contrast, fine patterns with improved resolution and aspect ratio, while maintaining stability of the resist material.

Implementation Method 1

a metal layer is formed on a resist film

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

irradiating an actinic ray such as an ultraviolet ray through a mask pattern

Methodology Applied

Scientific EffectElectron Beam: Electron Beam

Data Source

PatentUS12449737B2Pattern forming method, resist material, and pattern forming apparatus

Publication Date: 2025.10.21 OJI HLDG CORP

AI summary

It is an object of the present invention to provide a method of forming a high-contrast fine pattern onto a resist film. The present invention relates to a pattern forming method, comprising; applying a resist material onto a substrate to form a resist film, introducing a metal into the resist film, exposing, and developing. In addition, the present invention also relates to a resist material and a pattern forming apparatus.