Optical Sensing Module Using Metal Ribs for Tilt Stability
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Solution Overview
Problem
The existing lateral packaging structure of optical sensing modules is unstable due to uneven distribution of solder tin, leading to a biased gravity center and tilting of the structure, which affects product yield.
Innovation Solution
The optical sensing module incorporates metal ribs connected to conductive through holes on the transposition plate, allowing solders to climb to a higher height, enhancing adhesive force and structural strength, and includes designed soldering pad configurations to evenly distribute weight, reducing the inclination angle to less than 5 degrees.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive blind holes are used at the bottom of the transposition plate, then the soldering process is simplified, but the amount of tin is unevenly distributed causing the structure to be unstable and tilted
Solution Approach 1:
The patent transitions from using conductive blind holes (semi-blind structure) to conductive through holes that extend through the entire transposition plate. This dimensional change allows solder to flow completely through the plate, ensuring uniform tin distribution on both sides and eliminating the instability caused by biased gravity center.
Solution Approach 2:
The patent introduces metal ribs at specific locations on the transposition plate to locally enhance solder adhesion. These metal ribs create localized areas of improved solder wetting and bonding, ensuring adequate tin distribution even in critical regions while maintaining the simplified through-hole soldering approach.
2Ease of manufacture
If solder paste is concentrated at the lateral surface away from the sensing chip, then the soldering process is easier, but the amount of tin at the sensing chip side is insufficient causing tilting
Solution Approach 1:
By changing from blind holes to through holes, the patent enables solder to access both lateral surfaces of the transposition plate equally. This dimensional change ensures that the sensing chip side receives adequate tin distribution, providing sufficient adhesive force to support the chip weight and prevent tilting.
Solution Approach 2:
Metal ribs are strategically positioned on the transposition plate to locally enhance solder adhesion at critical areas. This local quality enhancement ensures that even with simplified soldering processes, the sensing chip side receives adequate tin and bonding strength.
3Loss of time
If the transposition plate is soldered with insufficient tin at the bottom, then the soldering time is reduced, but the structure tilts affecting product yield
Solution Approach 1:
The transition to through holes enables complete solder penetration through the transposition plate in a single soldering operation. This eliminates the need for prolonged soldering to achieve adequate tin distribution, reducing soldering time while ensuring proper bonding that prevents tilting and maintains high product yield.
Solution Approach 2:
Metal ribs provide localized enhancement of solder adhesion, ensuring that adequate bonding is achieved quickly and uniformly across the transposition plate. This allows for reduced soldering times while maintaining sufficient adhesive force to prevent structural tilting and preserve product yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved design stabilizes the optical sensing module by increasing the adhesive force and structural strength, preventing tilting and enhancing product yield by evenly distributing the weight, thus maintaining structural integrity.
Implementation Method 1
The plurality of solders respectively climb onto the plurality of metal ribs. A climbing height of each of the solders on a corresponding one of the metal ribs is a second height
Data Source
AI summary
An optical sensing module includes a substrate, an optical sensing device, and a plurality of solders. The substrate has an upper surface, and the upper surface has a plurality of first soldering pads. The optical sensing device is disposed upright on the substrate. The optical sensing device includes a transposition plate and an optical sensing package. The transposition plate includes a first surface, a second surface, and a third surface. The first surface has a plurality of second soldering pads, the second surface has a plurality of conductive through holes, and the third surface has a plurality of metal ribs. The conductive through holes are electrically connected to the second soldering pads and the metal ribs. The optical sensing package is disposed on the first surface and electrically connected to the second soldering pads. The plurality of solders climb onto the plurality of metal ribs, respectively.