Metal Structure Patterning via Seed Layer Template
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Solution Overview
Problem
The existing manufacturing processes for metal structures in electronic devices are time-consuming and material-intensive, leading to high costs and low efficiency, particularly in patterning circuits which require lengthy processing times and substantial material usage.
Innovation Solution
A method involving the formation of a seed layer on a substrate, followed by a patterned metal layer and a thinner first patterned photoresist layer, where a first patterning process creates a patterned seed layer with a metal member having a first part and a second part, where the first part's width is greater than the second part's width, allowing for improved adhesion with an insulating layer and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional patterning processes (exposure, development, etching) are used to define circuit patterns, then the circuits can be manufactured with required precision, but the processing time is long and material consumption is high
Solution Approach 1:
A seed layer is formed on the substrate before the main patterning process. This seed layer serves as a pre-prepared template that guides subsequent metal deposition, eliminating the need for traditional multi-step patterning processes and significantly reducing processing time while maintaining pattern precision.
Solution Approach 2:
The manufacturing process is divided into distinct stages: forming the seed layer, depositing metal on the seed layer, and then selectively removing portions. This segmentation allows each step to be optimized independently, reducing overall processing time while maintaining the required circuit pattern precision.
2Manufacturing precision
If conventional patterning processes are used to define circuit patterns, then the circuits can be manufactured with required precision, but material consumption is high
Solution Approach 1:
The seed layer is formed in advance with the exact pattern needed, serving as a template that guides metal deposition only where required. This eliminates material waste associated with traditional patterning methods that require excess material to be deposited and then removed.
Solution Approach 2:
Only the necessary metal material is deposited on the seed layer where the circuit patterns are needed. The seed layer acts as a mask that extracts and prevents material deposition in non-critical areas, significantly reducing material consumption while maintaining pattern precision.
3Reliability
If a thick photoresist layer is used for patterning, then complete coverage and protection is achieved, but exposure time increases and material usage increases
Solution Approach 1:
Instead of using a uniformly thick photoresist layer throughout, the invention uses a seed layer with varying thickness or composition in different regions. This local quality variation provides adequate protection where needed while allowing faster exposure and processing in other areas, reducing overall exposure time.
Solution Approach 2:
The seed layer's thickness, composition, or optical properties are modified in different regions to optimize both protection and exposure characteristics. By changing these parameters locally, the invention achieves reliable pattern protection without requiring uniformly thick photoresist, thus reducing exposure time and material usage.
4Manufacturing precision
If traditional multi-step patterning is used, then complex metal structures can be formed, but the manufacturing cost increases
Solution Approach 1:
The seed layer is formed in advance with the complete pattern design, serving as a permanent template that guides all subsequent metal deposition steps. This eliminates the need for multiple photoresist coating, exposure, and development cycles, significantly reducing manufacturing cost while maintaining the ability to form complex metal structures.
Solution Approach 2:
The seed layer serves multiple functions: it acts as a pattern template, a deposition mask, and a structural foundation for the metal layers. This multi-functionality eliminates the need for separate photoresist layers and multiple patterning steps, reducing manufacturing complexity and cost while maintaining the ability to create complex metal structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and improves efficiency by shortening exposure times, saving materials, and enhancing the adhesion between metal members and insulating layers, thereby increasing the reliability of electronic devices.
Implementation Method 1
performing a first patterning process to the seed layer through the first patterned photoresist layer
Data Source
AI summary
A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.