Heat Dissipating Metal Sheet on Semiconductor Package Solder Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing package substrates for large size chips, such as AI chips, suffer from poor heat dissipation, leading to overheating and reduced performance and lifespan of electronic packages.
Innovation Solution
A semiconductor package substrate design featuring a metal sheet with exposed first and second solder pads, where the insulation layer is only on the second holes' walls, allowing the first conductive elements to contact the metal sheet for enhanced heat dissipation, in addition to the metal and dielectric materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional package substrate with glass fiber and epoxy resin is used, then the substrate can support large size chips, but the heat dissipating efficiency is poor leading to heat accumulation
Solution Approach 1:
The patent applies composite materials by combining a metal sheet (high thermal conductivity) with a circuit board (structural support). The metal sheet is bonded to the ball planting side of the circuit board, creating a hybrid structure that leverages the thermal dissipation properties of metal while maintaining the mechanical integrity provided by the circuit board substrate.
Solution Approach 2:
The patent segments the heat dissipation function from the structural support function. The metal sheet is specifically positioned to handle thermal management, while the circuit board provides mechanical support. This segmentation allows each component to optimize its specific function without compromising the other.
2Reliability
If insulation layer is formed on all holes, then electrical insulation is provided, but heat dissipation path is blocked for solder pads
Solution Approach 1:
The patent applies local quality by selectively forming the insulation layer only on the second holes (signal transmission holes) and not on the first holes (solder pad holes). This localized approach ensures that electrical insulation is provided where needed (signal holes) while heat dissipation paths remain open at the solder pad locations where the metal sheet contacts the solder pads directly.
3Temperature
If metal sheet is added for heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The metal sheet serves multiple functions: it provides thermal management by dissipating heat, maintains structural integrity by being bonded to the circuit board, and enables electrical connection through the exposed solder pads. This multi-functionality reduces the need for separate components and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents heat accumulation, improving heat dissipation and ensuring the performance and lifespan of electronic packages by allowing heat to be dissipated through the metal sheet and first conductive elements during signal transmission.
Implementation Method 1
the heat dissipating efficiency of the package substrate 1a is poor, and the heat will accumulate in the package substrate 1a... the heat generated during a signal transmission process can be dissipated by a metal material... the heat generated during a signal transmission process can be dissipated not only by the metal material and dielectric material of the package substrate 1a, but also by the metal sheet
Implementation Method 2
a bonding material bonding the metal sheet onto the ball planting side of the circuit structure
Data Source
AI summary
A semiconductor package substrate, a method for fabricating the same, and an electronic package having the same are provided. The method includes: providing a circuit structure having a first solder pad and a second solder pad; forming on the circuit structure a metal sheet having a first hole, from which the first solder pad is exposed, and a second hole, from which the second solder pad is exposed; and forming an insulation layer on the metal sheet and a hole wall of the second hole. A first conductive element that is to be grounded is disposed in the first hole and is in contact with the metal sheet and the first solder pad. Therefore, heat generated in a signal transmission process is dissipated by the metal sheet and the first conductive element.