Metal Sintering Preparation for Conductive Low-Pressure Joining
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Solution Overview
Problem
Existing methods for connecting pressure- and temperature-sensitive components, such as LEDs or silicon chips, using adhesives result in insufficient heat and electrical conductivity at the contact sites.
Innovation Solution
A metal sintering preparation comprising 50 to 90% metal particles with a specific surface area and tamped density product of 40,000 to 80,000 cm^-1, coated with organic compounds, is used to create stable, low-porosity connections with high thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive technology is used to connect pressure- and temperature-sensitive components, then the components can be connected without high pressure and temperature, but the contact sites provide only insufficient heat conductivity and electrical conductivity
Solution Approach 1:
The patent changes the material parameters of the connection medium by using metal particles with specific physical properties (tamped density of 2.5-6.0 g/cm³ and specific surface area of 0.5-2.0 m²/g, giving a product of 1,250-12,000 cm⁻¹) instead of adhesive materials. This parameter change enables the connection to provide both mechanical stability and high thermal/electrical conductivity simultaneously.
Solution Approach 2:
The patent uses composite metal particle structures consisting of core metal particles with specific surface coatings. The composite structure combines the high thermal and electrical conductivity of metal cores with the protective and functional properties of surface coatings, achieving both connection reliability and energy conductivity.
2Reliability
If adhesive technology is used to connect components, then the components can be connected without high pressure and temperature, but the contact sites provide only insufficient electrical conductivity
Solution Approach 1:
The patent changes the material parameters by selecting metal particles with specific physical properties (tamped density and specific surface area product of 1,250-12,000 cm⁻¹) that inherently provide high electrical conductivity. This replaces adhesive materials with metallic materials that conduct electricity while maintaining connection stability.
Solution Approach 2:
The composite metal particle structure with conductive metal cores and functional coatings provides both mechanical bonding capability and high electrical conductivity, resolving the contradiction between connection stability and electrical conductivity.
3Loss of energy
If conventional sintering is used to connect components, then high thermal and electrical conductivity can be achieved, but the method is not suitable for pressure- and temperature-sensitive components
Solution Approach 1:
The patent changes the sintering parameters by using metal particles with optimized physical properties (tamped density and specific surface area product of 1,250-12,000 cm⁻¹) that enable effective sintering at lower temperatures. This allows achieving high thermal conductivity without subjecting sensitive components to excessive temperatures.
4Loss of energy
If conventional sintering is used to connect components, then high thermal and electrical conductivity can be achieved, but the method is not suitable for pressure- and temperature-sensitive components
Solution Approach 1:
The patent changes the material parameters by using metal particles with specific physical properties that enable effective sintering at reduced temperatures and pressures. This achieves high electrical conductivity in the connection while protecting temperature-sensitive components from thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces robust, low-porosity connections with enhanced conductivity, suitable for fragile components, without requiring pressure, thus maintaining component integrity and functionality.
Implementation Method 1
a metal sintering preparation that comprises (A) 50 to 90% by weight of at least one metal that is present in the form of particles which comprise a coating containing at least one organic compound, and (B) 6 to 50% by weight organic solvent, characterized in that the mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1
Data Source
AI summary
A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.