Metal Smart Card with Ferrite Shielding for Dual Interface

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Solution Overview

Problem

Dual interface smart cards with metal layers face challenges in maintaining radio-frequency communication while achieving a sophisticated, aesthetically pleasing appearance, as metal layers interfere with RF signals and require contact pads on the surface, which can disrupt the smooth exterior.

Innovation Solution

A method involving a metal layer with strategically formed cutouts and the use of a non-metallic plug to house the IC module, along with a ferrite layer to shield RF interference, allowing for both contactless and contact operations without visible depressions or bumps on the card's surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If a metal layer is added to the smart card for aesthetic appearance and weight, then the card's appearance and aesthetic value are improved, but the metal layer interferes with radio-frequency communication signals and attenuates RF signals

Engineering Contradiction:
Improveaesthetic appearanceVSAvoidRF communication
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The card is divided into distinct functional layers: an aesthetic metal layer for appearance, a non-conductive separator layer to isolate RF interference, and a ferrite layer for magnetic shielding. This segmentation allows each layer to perform its specific function without interfering with others, resolving the contradiction between aesthetic appearance and RF communication reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A non-conductive separator layer is introduced as an intermediary between the metal layer and the IC module/antenna. This separator prevents direct RF interference from the metal while maintaining the aesthetic appearance, acting as a mediator that resolves the conflict between these two requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If contact pads are placed on the top surface for contact interface operation, then contact capability is achieved, but the contact pads disrupt the smooth exterior and aesthetic appearance of the card

Engineering Contradiction:
Improvecontact interface capabilityVSAvoidsmooth surface
Core Design Contradiction:
Adaptability or versatilityVSShape

Solution Approach 1:

The contact pads are positioned on the bottom surface of the card rather than the top surface, utilizing a different spatial dimension. This allows the top surface to maintain its smooth, aesthetic appearance while the bottom surface provides the necessary contact interface functionality, resolving the contradiction between versatility and appearance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If the IC module is located near the top surface for contact operation, then contact interface functionality is achieved, but the metal layer interferes with radio-frequency signals between the chip and reader

Engineering Contradiction:
Improvecontact operationVSAvoidcontactless RF communication
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The card structure is segmented into distinct functional zones: the top surface for aesthetic appearance, a separator layer for RF isolation, and the IC module positioned in a location that enables contact operation while being shielded from metal layer interference. This segmentation resolves the contradiction between ease of contact operation and reliability of contactless communication.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A ferrite layer is introduced as a magnetic shielding intermediary between the IC module and the metal layer. This ferrite layer blocks magnetic interference from the metal while allowing the IC module to function properly for both contact and contactless operations, resolving the contradiction between operational ease and communication reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Shape

If a continuous metal layer is used for aesthetic appearance, then the card has a sophisticated appearance, but RF transmission is blocked by the metal layer

Engineering Contradiction:
Improvecontinuous metal surfaceVSAvoidRF transmission
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The card is segmented into multiple layers with a continuous metal layer for aesthetic appearance on the top surface, separated from the RF communication components by non-conductive and ferrite layers. This segmentation allows the metal layer to provide continuous aesthetic coverage while the separator layers prevent RF blocking, resolving the contradiction between appearance and transmission reliability.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective RF transmission and reception while maintaining a smooth, aesthetically pleasing appearance by isolating the IC module from the metal layer and using a ferrite shield to prevent metal layer interference, allowing the card to function as both contactless and contact smart card.

Implementation Method 1

a ferrite layer to shield RF interference

Methodology Applied
Scientific EffectFerromagnetism: Ferromagnetism

Data Source

PatentEP3779795B1Metal smart card with dual interface capability
Publication Date: 2024.04.24 COMPOSECURE LLC
  • EP3779795B1 patent drawingFigure 1~1B
  • EP3779795B1 patent drawingFigure 2
  • EP3779795B1 patent drawingFigure 2

AI summary

A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.