Metal Socket Body Protrusions for IC Package Alignment
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Solution Overview
Problem
Existing data centers face challenges in efficiently cooling and upgrading individual components due to the integration of different resource types with varying refresh rates, leading to suboptimal resource utilization and increased operational costs.
Innovation Solution
The implementation of chassis-less sleds with open circuit board substrates and independent power and cooling systems, allowing for modular and efficient resource allocation and upgrade without human intervention, and enhanced thermal management through optimized airflow and cooling designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional integrated IC packages with fixed resource types are used, then system stability is maintained, but resource utilization efficiency deteriorates due to inability to upgrade individual components
Solution Approach 1:
The patent divides the traditional integrated IC package into separate modular components: compute devices, storage devices, and communication devices can be independently selected, upgraded, and configured. This segmentation allows each component to be optimized and refreshed independently based on different requirements and technological cycles, thereby improving both resource utilization efficiency and adaptability.
2Loss of energy
If uniform cooling systems are used for all components, then system simplicity is maintained, but cooling efficiency deteriorates due to varying thermal requirements of different resource types
Solution Approach 1:
The patent implements localized cooling solutions tailored to specific thermal requirements of different component types. Compute devices, storage devices, and communication devices can have dedicated cooling mechanisms optimized for their respective heat generation patterns and thermal characteristics, improving overall cooling efficiency while managing complexity through modular design.
3Productivity
If manual intervention is required for component upgrades, then system control is maintained, but operational costs and time consumption increase
Solution Approach 1:
The patent enables self-service upgrade capabilities where modular components can be automatically detected, configured, and installed without manual intervention. The system can autonomously manage component refresh cycles, perform compatibility checks, and execute upgrade procedures, thereby reducing operational costs and time consumption while maintaining system control through automated management protocols.
Data Source
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AI summary
Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.