Metal Embossing Stamp for Nano-Structured Anti-Counterfeit Marking

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The challenge lies in authenticating original metal parts, particularly in the medical and automotive fields, where copycats produce reengineered parts that do not meet quality standards, leading to difficulties in identifying original components and fraudulent claims, and existing security features like laser markings can be easily reproduced.

Innovation Solution

A method for creating a metal stamp that embosses nano- and microstructures, specifically optical diffractive elements with gratings, directly onto metal devices, providing a secure and identifiable feature that is difficult to replicate, using a process involving a master tool, soft stamp, and reactive ion beam etching to create a durable and unique security mark.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional security features like laser markings are used, then identification capability is provided, but they can be easily reproduced by copycats

Engineering Contradiction:
Improveauthentication reliabilityVSAvoidreproducibility by copycats
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses Reactive Ion Beam Etching (RIE), a plasma-based process, to create nano- and microstructures directly in the metal stamp. This involves introducing reactive gases (oxygen, nitrogen, or fluorocarbon) into a vacuum chamber, generating plasma, and using ion bombardment to etch precise patterns into the stamp material. The plasma chemistry and ion energy control enable creation of complex 3D topographical structures that are extremely difficult to replicate with conventional marking methods.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The invention changes the scale parameter from conventional macroscopic laser markings to nanoscale and microscale structures (features on the order of 100 nanometers to several micrometers). This dimensional transformation creates security features with unique optical properties and physical characteristics that cannot be easily reproduced by standard manufacturing processes used by copycats.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If nano- and microstructures are embossed directly on metal devices, then authentication security is enhanced, but manufacturing complexity increases

Engineering Contradiction:
Improvecounterfeiting preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a master template containing the desired nano- and microstructure patterns before producing the metal stamp. This master template is used to define the 3D topographical structure that will be replicated in the stamp through RIE processing. By preparing the master template in advance, the complex patterning is accomplished once, and subsequent stamp production can replicate these patterns consistently across multiple devices.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention uses a master template to define the security feature pattern, which is then copied into the metal stamp through the RIE process. The stamp itself becomes a reusable tool that copies the security pattern onto multiple metal devices during embossing operations. This copying approach allows single-instance creation of the complex pattern master while enabling mass production of secured devices.

Inventive Principle:
Principle #26Copying

3Manufacturing precision

If soft stamp and imprint material are used, then manufacturing precision is improved, but additional process steps are required

Engineering Contradiction:
Improvepattern transfer accuracyVSAvoidnumber of process steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical embossing or stamping methods with a plasma-based RIE process to create the metal stamp's 3D topographical structures. Instead of mechanically pressing soft stamps to transfer patterns, the RIE process uses reactive ion bombardment and chemical reactions to directly etch the desired patterns into the metal stamp material, achieving higher precision and better structural fidelity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively adds a secure, abrasion-resistant, and tissue-compatible optical diffractive element to metal devices, enhancing authentication and preventing counterfeiting by creating unique, difficult-to-reproduce nano- and microstructures that maintain their integrity under disinfection and sterilization.

Implementation Method 1

etching the metal surface of the metal stamp to form said 3D topologically structured embossing area, wherein the metal etching in this step is carried out using reactive ion beam etching (RIBE) or ion beam milling (IBM)

Methodology Applied
Scientific EffectReactive ion beam etching: Ion Beam

Implementation Method 2

a metal stamp tool for applying the corresponding optical security feature directly onto and into the desired metal device, wherein the method comprises embossing the metal device with the metal stamp tool under plastic deformation conditions

Methodology Applied
Scientific EffectPlastic deformation: Plasticity

Data Source

PatentEP3547026B1Method for producing a metal stamp for embossing a nano- and/or microstructure on a metal device as well as uses thereof and devices made therewith
Publication Date: 2023.11.29 CSEM CENTRE SUISSE D ELECTRONIQUE ET DE MICROTECHNIQUE SA
  • EP3547026B1 patent drawingFigure 1a~1b
  • EP3547026B1 patent drawingFigure 1c~2
  • EP3547026B1 patent drawingFigure 3~4b

AI summary

The invention relates to a method for producing a metal stamp for embossing a nano- or microstructure on a metal device (4), comprising the following steps for producing a 3D structured embossing area (3) on the stamp: a) providing a master (30) having a structured surface (30a), and replicating said master (30a) in the surface of a soft stamp (31); b) forming an imprint (32) on the soft stamp (31a) using a cross-linkable material to form an imprint structured surface (32a), before, while or after contacting an opposite side of the imprint (32) with said surface portion of the metal stamp, and removing said soft-stamp (31) exposing said imprint structured surface (32a); c) etch-opening said surface (32a) using a first set of etching conditions; d) using a second set of etching conditions, different from the first ones, etching the surface of the metal stamp to form said embossing area (3).