Metal Strip Power Module Packaging With Integrated Magnetic Material
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Solution Overview
Problem
Current power module packaging technologies, such as PSiP, are complex, result in high losses and costs due to the need for pre-prepared magnetic elements with precise dimensional accuracy and multiple soldering steps, which complicates the manufacturing process.
Innovation Solution
A packaged module design incorporating a metal strip with integral ends forming a loop on a bearing structure, where the magnetic material covers the winding functional region, eliminating the need for separate magnetic elements and simplifying the packaging process by integrating the metal strip and magnetic material directly onto the bearing structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PSiP packaging technology is used with pre-prepared magnetic elements, then the power module can be assembled, but the packaging process becomes complex and manufacturing costs increase
Solution Approach 1:
The patent merges the magnetic element preparation process with the power module assembly process. Instead of preparing magnetic elements separately with precise dimensional accuracy requirements, the magnetic material is directly applied to the metal frame in the final assembly step, combining multiple operations into one and eliminating the need for pre-prepared components.
Solution Approach 2:
The patent extracts the magnetic element preparation step from the overall manufacturing process. By removing the requirement for separately prepared magnetic elements with precise dimensions, the complex preparation process is eliminated, and only the essential assembly step remains, significantly simplifying the packaging process.
2Manufacturing precision
If pre-prepared magnetic elements with precise dimensional accuracy are used, then the power module can be assembled, but manufacturing losses and costs increase
Solution Approach 1:
The patent replaces expensive, precisely manufactured magnetic elements with a more economical approach using magnetic material that is directly applied during assembly. This substitutes high-precision, high-cost components with a simpler, lower-cost material application process that achieves the same functional result without the associated manufacturing losses.
Solution Approach 2:
The patent changes the manufacturing parameters from requiring precise dimensional accuracy of pre-prepared magnetic elements to using a direct material application process. This parameter change eliminates the need for tight tolerances and associated manufacturing losses while maintaining the functional requirements of the power module.
3Reliability
If multiple soldering steps are performed for magnetic element assembly, then the power module can be assembled, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the magnetic element attachment with the final power module assembly step. Instead of performing separate soldering operations for magnetic element mounting, the magnetic material is applied and secured in the same step as the final assembly, reducing the total number of soldering steps while maintaining assembly reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs and losses by simplifying the packaging process, improving heat dissipation, and enabling 3D stacking, thus enhancing the performance and efficiency of the power module.
Implementation Method 1
The magnetic element includes a coil winding, two magnetic cores, and four pins welded to the coil winding. The two magnetic cores wrap the coil winding in pairs, so that the magnetic element can implement a function of inductance.
Implementation Method 2
The heat dissipation device comprises a heat dissipation fin and a circuit board with a heat conduction channel.
Implementation Method 3
The sleeve is operable to spread and radiate the heat generated by the converter.
Data Source
Figure 1~2a
Figure 2b~2c
Figure 3
AI summary
This application provides a packaged module and a metal plate. The packaged module may include a bearing structure, at least one metal strip, a circuit element, and a magnetic material. Specifically, a first surface of the bearing structure may bear the circuit element; two ends of each of the at least one metal strip may be coupled to the bearing structure, and a part of each metal strip other than the two ends is spaced apart from the bearing structure; and the magnetic material may cover a surface of a winding functional region of the at least one metal strip, where the winding functional region may be a part or all of the metal strip to which the winding functional region belongs. The foregoing solution helps simplify a packaging process and reduce losses and manufacturing costs of the packaged module.