Metal Structure Patterning With Step-Like Sidewalls for Adhesion
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Solution Overview
Problem
Current manufacturing methods for metal structures in electronic devices are inefficient and costly due to lengthy processing times and excessive material usage in patterning processes, which need to be optimized for reduced costs and improved efficiency.
Innovation Solution
A method involving the formation of a seed layer, a patterned metal layer, and a series of photoresist layers with controlled thicknesses to perform patterning processes, resulting in a metal structure with a step-like side surface that enhances adhesion with insulating layers, thereby improving the reliability of electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional patterning processes (exposure, development, etching) are used to define circuit patterns, then the metal structure can be formed, but the processing time is long and material consumption is high, resulting in high manufacturing cost and low efficiency
Solution Approach 1:
The patent segments the patterning process into two distinct stages: first forming a patterned metal layer with initial patterns, then forming a first patterned photoresist layer with different patterns. This segmentation allows each layer to serve specific functions - the metal layer provides conductive pathways while the photoresist layer defines final circuit patterns, thereby reducing overall processing time and material consumption compared to conventional single-stage patterning
Solution Approach 2:
The patent performs preliminary action by forming the patterned metal layer before forming the first patterned photoresist layer. The metal layer is prepared in advance with its patterns, and then the photoresist layer is formed on top to define the final circuit patterns. This preliminary preparation of the metal layer allows for optimized subsequent processing steps, improving overall manufacturing efficiency
2Ease of manufacture
If conventional patterning processes are used, then metal circuits can be defined, but the amount of materials used is excessive, increasing manufacturing cost
Solution Approach 1:
The patent segments material usage into two functional layers: the patterned metal layer that provides conductive pathways and the first patterned photoresist layer that defines final patterns. This segmentation allows precise material placement - the metal layer uses minimal material for conductivity while the photoresist layer uses minimal material for pattern definition, significantly reducing overall material consumption compared to conventional thick photoresist or multiple metal layers
Solution Approach 2:
The patent applies local quality by giving each layer its specific function and thickness optimized for that function. The patterned metal layer has thickness and material composition optimized for electrical conductivity, while the first patterned photoresist layer has thickness and material properties optimized for pattern definition. This localized optimization reduces material waste by using only the necessary amount of each material with the required properties
3Productivity
If a thin first patterned photoresist layer is used (thickness less than patterned metal layer), then processing time is reduced and efficiency is improved, but the adhesion between metal structure and insulating layers must be maintained
Solution Approach 1:
The patent transitions from a single-layer thick photoresist structure to a multi-layer structure where the first patterned photoresist layer is thinner than the patterned metal layer. This dimensional change creates a step-like profile where the metal layer extends beyond the photoresist layer on the sides. This multi-dimensional structure maintains adhesion through the vertical interface between layers while reducing the horizontal photoresist thickness for faster processing
Solution Approach 2:
The patent performs preliminary action by forming the patterned metal layer first, establishing a robust adhesive base layer before forming the thinner first patterned photoresist layer on top. This preliminary preparation of the metal layer with its adhesive properties ensures that even though the photoresist layer is thinner, the overall adhesion between the metal structure and subsequent insulating layers is maintained through the pre-established metal layer interface
Data Source
AI summary
A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.