Metal Substrate PCB Structure for High Rigidity and Thermal Dissipation
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Solution Overview
Problem
Conventional semiconductor substrates made of fiberglass face challenges in achieving high rigidity, fine line spacing, high-density, thinning, low cost, and high electrical characteristics due to material limitations and drilling methods like laser or mechanical drilling, which hinder miniaturization and high-frequency processing in electronic devices.
Innovation Solution
A substrate structure comprising a metal substrate, first and second connection layers, a metal core layer with openings, and a dielectric material layer, along with a manufacturing method that replaces fiberglass with a metal substrate, uses conductive layers for electrical connections, and eliminates the need for laser or mechanical drilling, enhancing rigidity and heat dissipation while allowing for fine line spacing and high-density packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If fiberglass substrate is used, then ease of manufacture is improved, but rigidity and heat dissipation deteriorate
Solution Approach 1:
The patent changes the fundamental material parameter of the substrate from fiberglass to metal (such as aluminum or copper). This material substitution fundamentally alters the physical and chemical properties, providing superior rigidity, strength, and heat dissipation capabilities while maintaining manufacturability through established metal processing techniques
Solution Approach 2:
The patent employs a composite structure consisting of a metal substrate combined with a metal core layer and dielectric material layer. This composite design integrates the advantages of different materials: the metal substrate provides rigidity and heat dissipation, while the dielectric layer provides insulation and structural support, achieving a balance between mechanical strength and electrical performance
2Device complexity
If laser drilling or mechanical drilling is used for blind holes, then manufacturing process is simplified, but manufacturing precision and fine line spacing capability deteriorate
Solution Approach 1:
The patent extracts and eliminates the drilling process entirely from the manufacturing flow. Instead of creating blind holes through laser or mechanical drilling, the design uses through-holes that are formed as part of the metal substrate structure itself, thereby removing the precision-limiting drilling step while simplifying the overall manufacturing process
Solution Approach 2:
The patent replaces the mechanical drilling system with a different manufacturing approach where conductive layers are deposited directly onto the substrate surface and patterned using photolithography and etching processes. This substitution of mechanical drilling with chemical deposition and patterning techniques enables much finer line spacing and higher manufacturing precision
3Ease of manufacture
If conventional substrate materials and drilling methods are used, then cost is reduced, but productivity and high-density packaging capability deteriorate
Solution Approach 1:
The patent changes the substrate material parameter from fiberglass to metal and eliminates the drilling process, which initially may increase manufacturing complexity but ultimately enables higher productivity. The metal substrate allows for better heat dissipation and structural integrity, supporting higher-density component placement and faster production cycles through more efficient manufacturing processes
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional vertical integration by utilizing through-holes and multiple conductive layers stacked in different planes. This dimensional expansion allows for higher-density packaging by utilizing the Z-axis (vertical dimension) for electrical connections, enabling more components to be packed in a smaller footprint area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved structural rigidity, heat dissipation, and electrical performance, enabling high-density, low-cost, and high-performance electronic packaging without the limitations of traditional drilling methods, thus supporting compact and versatile electronic products.
Implementation Method 1
The metal substrate, the first connection layer, the metal core layer, the second connection layer and the dielectric material layer are used to replace the conventional fiberglass substrate
Implementation Method 2
The metal core layer is electrically connected to one of the electrode pads via the metal substrate, the first and the second connection layers
Data Source
AI summary
A substrate structure includes a metal substrate, a first connection layer, a second connection layer, a dielectric material layer, a metal core layer and an internal component. The first and second connection layers are disposed on a surface of the metal substrate. The metal core layer having an opening is disposed on a surface of the first connection layer. The internal component having a plurality of electrode pads is disposed on a surface of the second connection layer and in the opening of the metal core layer. The dielectric material layer is disposed on the surface of the metal substrate. The first and second connection layers, the metal core layer and the internal component are partially covered with the dielectric material layer. The metal core layer is electrically connected to one of the electrode pads via the first and second connection layers and the metal core layer.