Metal Substrate Power Module with Press-Fit Connector Assembly
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Solution Overview
Problem
The cost of producing semiconductor power modules with DCB substrates is high due to material costs and the time and expense associated with processing steps such as forming and bonding conductive metal layers, and press-fit connector assembly.
Innovation Solution
A method and structure for forming a power semiconductor module using a planar sheet metal substrate with channels that partially extend through the substrate, forming islands, and encapsulating semiconductor dies with a molded body of encapsulant, followed by the arrangement of press-fit connectors for mechanical and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If DCB substrate with conductive metal layer is used, then electrical connection and heat dissipation are improved, but material cost and processing complexity increase
Solution Approach 1:
The patent extracts the conductive metal layer from the DCB substrate structure, eliminating the need for separate copper metallization layers. The press-fit connector directly contacts the ceramic substrate to provide electrical connection, removing the complex multi-layer DCB construction while maintaining electrical functionality.
Solution Approach 2:
The press-fit connector serves multiple functions: it provides mechanical support, electrical connection, and heat dissipation simultaneously. By integrating these functions into a single component that directly contacts the ceramic substrate, the patent eliminates the need for separate DCB layers, reducing processing complexity while maintaining reliability.
2Reliability
If DCB substrate with copper metallization is used, then electrical conductivity is improved, but material cost increases
Solution Approach 1:
The patent replaces expensive copper metallization layers with a simpler structure using the ceramic substrate itself and press-fit connectors. This eliminates the need for costly copper bonding materials while maintaining adequate electrical conductivity through the direct contact mechanism.
Solution Approach 2:
The patent discards the conventional DCB copper metallization approach entirely, using only the ceramic substrate and press-fit connectors for electrical connection. This eliminates material costs associated with copper layers, adhesive bonding, and complex metallization processing while recovering functionality through the simplified structure.
3Reliability
If press-fit connectors are assembled with DCB substrate, then electrical connection is achieved, but assembly time and expense increase
Solution Approach 1:
The press-fit connectors are designed to be pre-formed with their electrical contact features, allowing them to be directly inserted into the ceramic substrate without requiring separate bonding operations. This preliminary preparation of the connectors enables faster assembly by eliminating multiple processing steps required in conventional DCB assembly.
Solution Approach 2:
The patent merges the electrical connection function with the mechanical support function into a single press-fit connector component. This consolidation eliminates the need for separate bonding operations and multiple assembly steps, reducing assembly time and expense while achieving reliable electrical connection.
Data Source
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AI summary
A method of forming a power semiconductor module includes providing a substrate of planar sheet metal, forming channels in an upper surface of the substrate that partially extend through a thickness of the substrate and define a plurality of islands in the substrate, mounting a first semiconductor die on a first one of the islands, forming a molded body of encapsulant that covers the substrate, fills the channels, and encapsulates the semiconductor die, forming a hole in the molded body and a recess in the upper surface of the substrate beneath the hole, and arranging a press-fit connector in the hole and forming a mechanical and electrical connection between an interior end of the press-fit connector and the substrate.