Metal-Substrate Temperature Sensor With Selective Insulation Contacting
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Solution Overview
Problem
Existing temperature sensors face challenges in achieving small dimensions, high measurement accuracy, and simplicity in production, with previous designs being complex and limited in accuracy.
Innovation Solution
A temperature sensor is designed with a metal substrate having an insulation layer on one side and a sensor structure formed on an insulation-free portion, allowing electrical contact on opposite sides, using a meandering structure and contact pads, and utilizing materials like platinum and aluminum oxide layers for high accuracy and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a feedthrough is introduced into an insulating substrate to connect contact pads, then electrical connection is achieved, but production complexity increases
Solution Approach 1:
The patent removes the insulating substrate from the sensor structure, replacing it with a metal substrate that provides both mechanical support and electrical connection functions. This eliminates the need for complex feedthrough structures and multiple production steps, directly resolving the contradiction between reliable electrical connection and production simplicity.
Solution Approach 2:
The metal substrate serves multiple functions simultaneously: it provides mechanical support, electrical connection, and thermal conduction. This multi-functionality eliminates the need for separate feedthrough components and insulating layers, reducing production complexity while maintaining reliable electrical connections.
2Reliability
If side surfaces are metallized and solder connections are formed, then secure electrical connection is achieved, but production complexity increases
Solution Approach 1:
The patent eliminates the need for side surface metallization and solder connections by using a metal substrate where the sensor structure is formed directly on the substrate surface. Electrical connections are achieved through conductive paste applied to the sensor structure, removing multiple complex production steps while maintaining reliable electrical connectivity.
3Volume of moving object
If a semiconductor material is used for small temperature sensors, then small structural size is achieved, but measurement accuracy is limited
Solution Approach 1:
The patent uses a composite structure combining metal substrate with conductive paste sensor material. This allows the sensor to achieve small dimensions through thin-film deposition while maintaining high measurement accuracy through the superior electrical properties of the conductive paste, overcoming the limitations of semiconductor materials.
4Reliability
If insulation layer covers entire substrate, then electrical insulation is achieved, but electrical contacting becomes complex
Solution Approach 1:
The patent applies the insulation layer selectively only in regions where electrical insulation is required, leaving areas exposed for direct electrical contact with the metal substrate. This local application of insulation simplifies electrical contacting while maintaining adequate insulation where needed, resolving the contradiction between insulation reliability and contacting complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor achieves high accuracy with small dimensions, reduced mass, and faster response time, with a simple production process, overcoming the limitations of previous designs.
Implementation Method 1
an insulation layer (20) which covers the front side (16) only in portions
Implementation Method 2
a sensor structure, in particular a resistive sensor structure (30), which is formed on the insulation layer
Data Source
AI summary
A temperature sensor comprising:a substrate, formed from a metal element, in particular a metal foil, wherein the substrate has a front and a rear side,an insulation layer, which covers the front side of the substrate only in some portions, in such a way that an insulation-layer-free portion is formed on the front side of the substrate, anda sensor structure, in particular a resistive sensor structure, which is formed on the insulation layer and insulation-layer-free portion of the front side of the substrate,wherein the sensor structure has at least two electrical contacting portions, and a first contacting portion is connected to the insulation-layer-free portion of the front side of the substrate, and a second contacting portion is a first contact path or is connected to a first contact path, wherein the first contact path is preferably arranged on the insulation layer.