Metal-Supported Packaged Circuit Structure for Thin Component Integration
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Solution Overview
Problem
The challenge is to reduce the size of circuit boards in electronic products while maintaining structural integrity and facilitating the installation of electronic components.
Innovation Solution
A multilayer circuit board with an opening area supported by a metal portion, where the opening is sealed at the bottom by the metal portion, allowing for the installation of electronic components, and an insulating layer encapsulates the component, enhancing bearing strength and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the circuit board size is reduced to make electronic products smaller, then the overall dimensions are improved, but the structural integrity and stability deteriorate
Solution Approach 1:
The patent introduces a vertical dimension by creating a through-opening that penetrates the circuit board thickness. This allows the metal portion to extend from one surface to the opposite surface, providing structural reinforcement in the thickness direction without increasing the planar dimensions of the circuit board.
Solution Approach 2:
The patent combines multiple materials with complementary properties: the circuit board substrate provides planar support, the metal portion provides mechanical strength and stability, and the insulating layer provides electrical isolation. This composite structure achieves both small size and structural integrity.
2Length of moving object
If the circuit board size is reduced, then the overall dimensions are improved, but the ease of component installation deteriorates
Solution Approach 1:
The patent segments the circuit board into distinct functional zones: the opening area for component placement, the metal portion for structural support, and the insulating layer for electrical isolation. This segmentation creates a dedicated space for component installation while maintaining small overall dimensions.
Solution Approach 2:
By utilizing the thickness dimension through the through-opening, the patent creates vertical space for component installation without increasing the planar area. This allows components to be mounted on the circuit board surface while maintaining a compact footprint.
3Ease of operation
If an opening is created for component installation, then the ease of component installation is improved, but the structural integrity deteriorates
Solution Approach 1:
The patent creates a composite structure where the metal portion is integrated with the circuit board substrate. The metal portion extends through the opening and is bonded to the substrate, creating a reinforcement structure that compensates for the structural weakness introduced by the opening.
Solution Approach 2:
The patent uses a curved or tapered metal portion shape that provides structural reinforcement around the opening. The curved geometry distributes mechanical stresses more effectively than a flat or angular shape, maintaining structural integrity while accommodating the opening for component installation.
Data Source
AI summary
A package circuit structure includes a multilayer circuit board, an electronic component, and an insulating layer. The multilayer circuit board includes a metal portion and an opening. The opening is extending from a first side of the multilayer circuit board toward the second side of the multilayer circuit board facing the first side. A bottom of the opening is sealed by the metal portion. The electronic component is received in the opening and adhered to the metal portion. The electronic component is electrically connected to the multilayer circuit board and encapsulated in the opening by the insulating layer. A method for manufacturing the package circuit structure is also provided.