Metal Tab Ring Structure for Power Module Gate Contact Alignment
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Solution Overview
Problem
Challenging alignment of tabs with clips in power semiconductor modules with center holes, and the rubber-like consistency of dielectric materials reducing the long-term reliability of gate wire bonds due to potential interaction with center gate connections.
Innovation Solution
A connector structure featuring a metal tab with a raised ring portion and slots, designed to align easily with a clip, preventing filler material from contacting the gate contact and reducing thermal stress through slots and chamfered designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a tab with a center hole is used to access the gate contact in SCR modules, then the gate contact can be reached, but the alignment of tabs with clips becomes challenging
Solution Approach 1:
The patent introduces a raised ring structure that extends vertically from the tab surface, creating a three-dimensional alignment feature. This vertical dimension provides a mechanical reference that simplifies the alignment process between tabs and clips during assembly, resolving the manufacturing precision issue while maintaining gate contact accessibility through the center hole.
2Object-affected harmful factors
If dielectric material with filler content is used to increase moisture resistance, then moisture resistance improves, but the rubber-like consistency reduces long-term reliability of gate wire bonds
Solution Approach 1:
The patent extracts the gate contact area from the filler-containing dielectric material by creating a void or cavity around the gate contact region. This separation removes the harmful rubber-like filler material from contact with the gate wire bond while maintaining the moisture-resistant properties of the filler material in other areas of the module.
Solution Approach 2:
The patent introduces a barrier layer or intermediary structure between the filler-containing dielectric material and the gate contact area. This intermediary prevents direct contact between the rubber-like filler and the gate wire bond, eliminating the reliability issue while preserving the moisture resistance function of the filler material.
3Reliability
If the interface area between tab and chip is maximized to assure high electrical and thermal transfer, then conductivity improves, but the complexity of tab design increases
Solution Approach 1:
The patent divides the tab structure into distinct functional segments: a flat interface area for maximizing electrical and thermal contact with the chip, and a raised ring structure for providing mechanical alignment and structural support. This segmentation allows each part to optimize its specific function without unnecessarily increasing overall complexity.
Data Source
AI summary
A connector for contacting a semiconductor chip. The connector may include a tab, where the tab includes an outer portion, having a planar shape, the outer portion having a lower surface, adapted to contact a surface of the semiconductor chip, and an upper surface that defines a main plane of the tab. The tab may also include a ring portion, the ring portion connected to the outer portion and extending proud of the main plane, wherein the ring portion defines an inner hole within the tab structure, the inner hole being adapted to expose a contact portion of the surface of the semiconductor chip, wherein the ring portion includes at least two slots. The connector may further include a clip, comprising a connection portion, the connection portion having an aperture that is adapted to couple around the ring portion.