Metal Thin-Film IC Package for Low-Resistance Heat Dissipation
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Solution Overview
Problem
Existing integrated circuits with heat dissipation fins suffer from high thermal resistance, increased volume, and manufacturing costs, which contradict the design trend of lightweight, thin, short, and small integrated circuits.
Innovation Solution
An integrated circuit with a metal thin film layer coated on the packaging shell's top surface and/or side surfaces, reducing thermal resistance by minimizing the thermal resistance from the bare chip junction to the packaging shell and eliminating the need for conventional heat dissipation fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation fins are installed on the integrated circuit, then heat dissipation capability is improved, but thermal resistance remains too high due to multiple interface resistances
Solution Approach 1:
The patent extracts and eliminates the TIM layer from the heat dissipation path, directly bonding the heat dissipation fin to the crystal interface. This removes the additional thermal resistance introduced by the TIM layer, resolving the contradiction between heat dissipation capability and thermal resistance.
Solution Approach 2:
The patent merges the heat dissipation fin directly with the crystal interface through direct bonding, eliminating the intermediate TIM layer. This integration reduces the number of thermal interfaces and lowers overall thermal resistance while maintaining effective heat dissipation.
2Temperature
If heat dissipation fins are installed on the integrated circuit, then heat dissipation capability is improved, but volume and manufacturing cost increase
Solution Approach 1:
The patent employs thin film technology for the heat dissipation fin structure, which maintains effective heat dissipation surface area while significantly reducing the overall volume and thickness of the component, aligning with lightweight and compact design trends.
Solution Approach 2:
The patent replaces the conventional mechanical assembly of separate TIM and fin components with a direct bonding process, simplifying the structure and reducing volume while maintaining heat dissipation effectiveness.
3Temperature
If heat dissipation fins are installed on the integrated circuit, then heat dissipation capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the TIM layer from the manufacturing process, reducing the number of material purchases, inventory management requirements, and assembly steps, thereby lowering manufacturing costs while maintaining heat dissipation performance.
Solution Approach 2:
The patent combines the heat dissipation fin bonding process with the existing crystal mounting process, eliminating the need for separate TIM application and fin installation steps, thereby reducing manufacturing complexity and cost.
4Temperature
If conventional heat dissipation fins are used, then heat dissipation is achieved, but the design trend of lightweight, thin, short, and small is compromised
Solution Approach 1:
The patent uses thin film heat dissipation fin structures that provide effective heat dissipation surface area with minimal thickness and weight, fully complying with the lightweight and thin design requirements of modern integrated circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated circuit achieves low thermal resistance and small volume while providing an electromagnetic barrier by utilizing a metal thin film layer with high thermal conductivity, effectively reducing manufacturing costs.
Implementation Method 1
The thermal resistance of the integrated circuit with metal thin film in accordance with the present invention can be regarded as only the thermal resistance from the bare chip junction to the packaging shell
Implementation Method 2
due to the presence of the metal thin film layer on the top surface or the side surfaces, or both the top surface and the side surfaces of the packaging shell, the metal thin film not only prevents external signal interference, but also prevents internal electromagnetic fields from leaking to the outside
Data Source
AI summary
An integrated circuit with a metal thin film includes: a packaging shell with a top surface, a plurality of side surfaces and a bottom surface. The side surfaces each have one end connected to the top surface and the other surface connected to the bottom surface. The bottom surface includes a plurality of metal pins; and a metal thin film layer coated on the top surface, or at least one of the side surfaces, or both the top surface and at least one of the side surfaces.