Metal Underlayer Wiring Pattern Formation via Solid Electrolyte Etching
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Solution Overview
Problem
Existing methods for forming wiring patterns on resin substrates require individual electrical connection of underlying wiring layers to a power supply during electroplating, which is challenging for complex or densely packed metal wiring configurations.
Innovation Solution
A method involving the formation of a metal underlayer with a connection layer that connects non-electrode-contacting underlying wiring layers, followed by electroplating and subsequent etching using a solid electrolyte material to remove the connection portion, allowing metal plating without direct electrode contact to all underlying layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual electrical connection is performed for all underlying wiring layers during electroplating, then metal plating layers can be formed on each wiring layer, but the process becomes extremely difficult and time-consuming for complex or densely packed wiring patterns
Solution Approach 1:
The underlying wiring layers are segmented into two categories: those that require direct electrode contact for plating and those that do not. The invention separates the plating process into stages, with the first plating layer formed only on wiring layers in contact with the electrode, while subsequent layers are formed on all underlying wiring layers through the conductive resin layer interconnection.
Solution Approach 2:
The conductive resin layer serves as an intermediary that provides electrical connection between the electrode and underlying wiring layers that are not in direct contact with the electrode. This mediator enables current flow to reach isolated wiring layers without requiring separate electrode contact for each layer.
2Reliability
If all underlying wiring layers are brought into contact with the electrode, then complete metal plating can be achieved, but the device complexity and difficulty of the process increase significantly
Solution Approach 1:
The conductive resin layer performs multiple functions: it acts as an adhesive bonding the metal underlayer to the resin substrate, provides electrical conduction to supply current to underlying wiring layers, and serves as a structural matrix. This multi-functionality eliminates the need for separate connection structures for each wiring layer.
Solution Approach 2:
The invention merges the adhesive layer and electrical connection function into a single conductive resin layer. By combining these functions, the process simplifies the electrode arrangement required, as the resin layer itself provides the connection path rather than requiring separate conductive elements for each wiring layer.
3Manufacturing precision
If individual connection work is performed on each underlying wiring layer, then accurate plating can be achieved, but the production time and cost increase for densely packed wirings
Solution Approach 1:
The electroplating process continues uniformly across all underlying wiring layers through the conductive resin layer without interruption. The current flows continuously through the resin to reach all isolated wiring layers, enabling simultaneous plating of multiple layers in a single operation rather than requiring sequential individual plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of metal plating layers on underlying wiring layers without the need for individual electrical connection to a power supply, simplifying the process for complex or densely packed wiring patterns.
Implementation Method 1
forming a metal plating layer on a surface of the metal underlayer through electroplating
Implementation Method 2
impregnating a solid electrolyte material with a solution into which metal of the underlying connection layer and metal of the metal plating layer are dissolved
Implementation Method 3
the etching includes bringing the solid electrolyte material into contact with the portion of the metal connection portion and applying a voltage between an anode and a cathode, the cathode being the solid electrolyte material and the anode being the portion of the metal connection portion
Data Source
AI summary
A method of forming a wiring pattern includes: a) forming a metal underlayer including a first underlying wiring layer which is in contact with an electrode, a second underlying wiring layer which is not in contact with the electrode, and an underlying connection layer which connects the first underlying wiring layer to the second underlying wiring layer; b) forming a metal plating layer on the metal underlayer through electroplating; and c) removing a metal connection portion through etching. The metal connection portion is the underlying connection layer covered with the metal plating layer. The etching includes bringing a solid electrolyte material that contains a solution into which metal of the metal connection portion is dissolved, into contact with the metal connection portion and applying a voltage between the metal connection portion and the solid electrolyte material.