Metal Support Wall Structure for EMI-Shielded Electronic Modules

The patent combines the electromagnetic interference suppression function with the existing substrate structure by integrating a ground conductor layer into the substrate's internal layers. This merging approach allows the substrate to serve dual purposes: mechanical support and EMI shielding, thereby reducing device complexity while maintaining effective electromagnetic interference suppression.

The patent introduces a ground conductor layer as an intermediary element within the substrate structure. This ground layer acts as a mediator that provides electromagnetic interference suppression without requiring additional external metal walls or shielding structures, thus improving EMI protection while avoiding increased device complexity.

The patent segments the metal member into distinct functional portions: a plate-shaped portion for EMI shielding and support portions with notches for mechanical stability. This segmentation allows each portion to be optimized independently, where the notched support portions provide self-standing ability through geometric design rather than precise dimensional control, thereby reducing manufacturing precision requirements while maintaining stability.

The patent incorporates curved or bent geometries in the support portions, particularly the notched configurations that allow the metal member to stand independently. These curved features provide mechanical stability through geometric constraints rather than relying on tight tolerances, thus improving self-standing ability while reducing the need for high manufacturing precision.