Metal Wire Manufacturing Insulating Layer Adhesion
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Solution Overview
Problem
Conventional methods for manufacturing narrow metal wires for high-resolution liquid crystal displays face issues with photoresist denaturation during etching, leading to metal wire breakage due to the flow of etching solutions between the photoresist and the metal wire.
Innovation Solution
A method involving the formation of an insulating layer, such as oxides, nitrides, or nitroxides, between the metal layer and the photoresist, which enhances adhesion and prevents breakage by supplying oxygen during the ashing process to remove the photoresist, thereby maintaining the integrity of the metal wire during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the width of metal wire is reduced to enhance resolution, then the resolution of liquid crystal display is improved, but the photoresist becomes more prone to denaturation and tilt during etching, causing metal wire breakage
Solution Approach 1:
An insulating layer is introduced as an intermediary between the photoresist and the metal wire. This insulating layer prevents direct contact between the etching solution and the photoresist, eliminating the denaturation and tilting problems. The insulating layer serves as a protective mediator that allows narrow metal wire fabrication without compromising photoresist stability or metal wire integrity.
2Ease of manufacture
If the photoresist is in direct contact with the etching solution during etching, then the etching process can be performed, but the photoresist denatures and tilts, allowing etching solution to flow along the gap and corrode the metal wire
Solution Approach 1:
The insulating layer acts as a protective intermediary that blocks the harmful interaction between the etching solution and the photoresist. It allows the etching process to proceed effectively while preventing the photoresist from denaturing and preventing etching solution from infiltrating along gaps to corrode the metal wire.
Solution Approach 2:
Oxygen plasma treatment is applied to the insulating layer surface to enhance its adhesion properties. The strong oxidizing environment creates oxygen-containing functional groups on the insulating layer surface, improving its bonding strength with both the photoresist and the metal wire, thereby preventing photoresist detachment during etching.
3Reliability
If an insulating layer is added between the metal layer and photoresist, then photoresist adhesion is improved and breakage is prevented, but the manufacturing process steps are increased
Solution Approach 1:
The manufacturing process is segmented into distinct functional stages: forming the metal layer, forming the insulating layer, coating the photoresist, and performing etching. This segmentation allows each layer to perform its specific function independently, with the insulating layer specifically addressing the adhesion and protection requirements, making the overall process more controllable and reliable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents metal wire breakage, improving product yield by ensuring the metal wire remains intact even when narrowed, thus enhancing the manufacturing process for high-resolution displays.
Implementation Method 1
An insulating layer is formed between a metal layer and a photoresist, so that the insulating layer has a good adhesion to the metal layer
Implementation Method 2
the step of etching the metal layer on the photoresist non-retained region further comprises: ashing the photoresist on the photoresist retained region to remove the photoresist on the photoresist retained region. oxygen is supplied in the step of ashing the photoresist on the photoresist retained region
Data Source
AI summary
A method for manufacturing a metal wire and an array substrate includes the steps of forming a metal layer, an insulating layer, and a photoresist on the substrate sequentially; exposing the photoresist to form a photoresist retention region and a photoresist non-retention region; developing the photoresist non-retention region; etching the insulating layer to expose a region of the metal layer to be etched; and etching the metal layer to remove portions not covered by the photoresist retention region to form a metal wire.