3D Metal Wire Deposition Using Ohmic and Laser Heating

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Solution Overview

Problem

Current 3D metal printing technologies face limitations in producing high-strength, high-temperature metal parts due to material constraints, require extensive infrastructure, are costly, and involve hazardous materials, with processes being slow and resulting in rough surface finishes.

Innovation Solution

A combined laser and ohmic heating system using fine metal wire feedstock, where ohmic heating preheats the wire and a laser completes the melting, allowing for precise, rapid deposition of metal with reduced waste and improved surface finish.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If metal powder is used as feedstock with laser sintering, then metal parts can be produced, but the process is slow and produces rough surface finishes

Engineering Contradiction:
Improvedeposition speedVSAvoidsurface finish quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the feedstock form from metal powder to metal wire, and introduces dual heating modes (ohmic and laser) to alter the heating parameters. This enables faster deposition speeds while achieving smooth surface finishes through controlled melting and solidification of the wire feedstock.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical powder spreading process with a wire feeding system. The wire is fed through a heating zone where ohmic and laser heating melt it, and the molten metal is deposited directly onto the substrate, eliminating the need for powder spreading mechanisms and achieving both high speed and smooth surfaces.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If conventional laser heating of metal wire is used, then metal deposition is achieved, but the heating process is inefficient and slow

Engineering Contradiction:
Improvedeposition rateVSAvoidheating efficiency
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent applies ohmic heating to preheat the metal wire before it enters the laser heating zone. This preliminary heating action raises the wire temperature close to the melting point, reducing the energy and time required for the laser to complete the melting process, thereby increasing overall deposition efficiency and rate.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent combines ohmic heating and laser heating into a unified heating system. The ohmic heating provides bulk preheating of the wire, while the laser provides focused melting at the deposition point. This merging of two heating mechanisms creates a synergistic effect that dramatically improves heating efficiency and deposition rate compared to using either method alone.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If metal powder feedstock is used, then metal parts can be printed, but hazardous materials and extensive infrastructure are required

Engineering Contradiction:
Improvematerial handling safetyVSAvoiddeposition speed
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent uses metal wire feedstock instead of metal powder. Wire is inherently safer to handle, store, and process compared to fine metal powders which can be hazardous. The wire feedstock system is simpler and requires less extensive infrastructure while maintaining high deposition speeds through the combined ohmic-laser heating approach.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Productivity

If high deposition speed is achieved, then productivity increases, but surface finish quality deteriorates

Engineering Contradiction:
Improvedeposition speedVSAvoidsurface finish quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The ohmic preheating of the wire ensures that the material enters the laser melting zone at an optimized temperature, enabling faster deposition without compromising the melting quality. This preliminary preparation allows the laser to efficiently melt and deposit metal at high speeds while maintaining smooth surface finishes through controlled solidification.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent optimizes the combination of ohmic heating power, laser power, and wire feed speed to achieve a parameter regime where high deposition rates produce smooth surfaces. The controlled heating rates and temperature gradients achieved through dual heating enable rapid solidification with minimal surface roughness, resolving the typical trade-off between speed and quality.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of high-density metal parts with improved surface finish and reduced costs, increased speed, and safer handling of materials, overcoming the limitations of existing technologies.

Implementation Method 1

ohmic heating preheats the wire and a laser completes the melting

Methodology Applied
Scientific EffectOhmic heating: Joule Heating

Implementation Method 2

a laser completes the melting

Methodology Applied
Scientific EffectLaser heating: Laser

Data Source

PatentUS10994371B2System and method for depositing a metal to form a three-dimensional part
Publication Date: 2021.05.04 MITSUBISHI ELECTRIC RESEARCH LABORATORIES INC
  • US10994371B2 patent drawing

AI summary

A system and method depositing metal to form a three-dimensional (3D) part on a substrate. A wire is moved relative to a location on the substrate while a laser heats a proximal end of the wire at the location using a laser beam. The laser causes the wire and substrate to reach a melting point of the wire to fuse the wire at the location on the substrate. The wire can be preheated by passing a current through the wire.