Metal Wiring Board Layout for Stable Semiconductor Module Assembly
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Solution Overview
Problem
The existing metal wiring boards in semiconductor modules often experience instability in their arrangement posture due to shifts in the center of gravity caused by their shape, leading to potential mechanical and electrical issues during module assembly and operation.
Innovation Solution
A metal wiring board design featuring a first and second joining portion with a coupling portion, where one side of each joining portion faces each other, and one end of the coupling portion is coupled to the widthwise center of the joining portions, stabilizing the arrangement posture by maintaining the center of gravity near the coupling portion and reducing thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the metal wiring board has an asymmetric shape, then it can provide functional advantages in wiring, but the center of gravity shifts causing instability in arrangement posture
Solution Approach 1:
The patent applies asymmetry principle by designing the coupling portion with an L-shaped configuration where one end is coupled to the widthwise center of the first joining portion and the other end to the second joining portion. This asymmetric design allows the coupling portion to effectively balance the center of gravity while maintaining flexible wiring configuration capabilities.
Solution Approach 2:
The patent implements equipotentiality by positioning the coupling portion such that it balances the center of gravity of the entire metal wiring board. The L-shaped coupling portion with specific dimensional relationships (where the length in the width direction of the first joining portion is greater than or equal to the length in the width direction of the second joining portion) creates a balanced gravitational field, ensuring stable arrangement posture during assembly and operation.
2Ease of manufacture
If the metal wiring board is joined in advance to laminate substrate or semiconductor chip, then assembly is simplified, but inclined joining may occur due to center of gravity shift
Solution Approach 1:
The patent applies preliminary action by designing the coupling portion with balanced center of gravity characteristics before the actual joining process. This pre-balanced design ensures that when the metal wiring board is joined in advance to the laminate substrate or semiconductor chip, it maintains a horizontal posture without inclination, thereby simplifying the assembly process while ensuring precise joining position.
3Adaptability or versatility
If the coupling portion is positioned away from the center of joining portions, then wiring flexibility is improved, but arrangement posture becomes unstable
Solution Approach 1:
The patent applies dimensionality change by utilizing the L-shaped configuration of the coupling portion that extends in multiple directions. One end couples to the widthwise center of the first joining portion while the other end couples to the second joining portion, creating a three-dimensional balance structure that maintains stability while providing wiring flexibility in different spatial dimensions.
Data Source
AI summary
A metal wiring for connecting a semiconductor element and to a circuit board, includes: a first joining portion having a rectangular shape in a planar view and configured to be joined to an upper surface of a main electrode of the semiconductor element; a second joining portion having a rectangular shape in the planar view and joined to an upper surface of the circuit board; and a coupling portion having first and second joining sides, respectively connected to coupling sides of the first and second joining portions so as to couple the first and second joining portions such that the coupling sides of the first and second joining portions face each other. The first joining side of the coupling portion is coupled to the coupling side of the first joining portion approximately at a center thereof in a first direction parallel to the coupling side of the first joining portion.