Metallic Bonding for Sensor Mounting on Large Structures

Solution Overview

Problem

Conventional methods for mounting sensors to large structures are limited by the need for conventional ovens or reflow equipment, which can be impractical due to size constraints or location issues, leading to the use of adhesives that restrict operating temperature, reduce sensor sensitivity, and increase manufacturing costs.

Innovation Solution

A system utilizing metallic bonding layers and joints to securely attach sensors to structures, enabling higher operating temperatures and improved sensitivity, with the sensor and structure bonding layers being metallic alloys coupled via a metallic joint, allowing for accurate data sensing through the joint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If adhesive or epoxy material is used to mount sensor to structure, then sensor can be mounted to large structures that cannot fit into conventional ovens, but operating temperature is limited and sensor sensitivity is reduced

Engineering Contradiction:

Improvemounting capability to large structuresVSAvoidsensor sensitivity

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent changes the bonding material from adhesive/epoxy to metallic bonding layers and joints, fundamentally altering the material parameters to achieve both high-temperature capability and high sensor sensitivity while enabling mounting on large structures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite bonding system consisting of metallic bonding layers applied to both the sensor and structure, joined through metallic joints, creating a composite material system that combines the advantages of metallic bonding (high temperature resistance, high sensitivity) with the adaptability to mount on large structures

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If adhesive or epoxy material is used to mount sensor to structure, then sensor can be mounted without conventional reflow equipment, but operating temperature is limited

Engineering Contradiction:

Improvemounting process simplicityVSAvoidoperating temperature

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent changes the bonding material from adhesive/epoxy to metallic bonding layers and joints, fundamentally altering the material parameters to achieve both high-temperature capability and high sensor sensitivity while enabling mounting on large structures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the chemical bonding mechanism of adhesives/epoxies with metallic bonding mechanisms (soldering, brazing, or welding), substituting one bonding paradigm with another that enables higher operating temperatures while maintaining ease of manufacture through established metallic joining techniques

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If adhesive or epoxy material is used to mount sensor to structure, then sensor can be mounted in field or production setting, but significant time is required for curing which increases manufacturing costs

Engineering Contradiction:

Improvemounting location flexibilityVSAvoidcuring time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent replaces the chemical bonding mechanism of adhesives/epoxies with metallic bonding mechanisms (soldering, brazing, or welding), substituting one bonding paradigm with another that enables higher operating temperatures while maintaining ease of manufacture through established metallic joining techniques

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding material from adhesive/epoxy to metallic bonding layers and joints, fundamentally altering the material parameters to achieve both high-temperature capability and high sensor sensitivity while enabling mounting on large structures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances sensor sensitivity and operating temperature capabilities while reducing material creep, improving the accuracy and reliability of strain data transfer, and allowing for on-site or in-production mounting without the need for conventional reflow ovens.

Implementation Method 1

the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer

Methodology Applied

Scientific EffectStrain transfer: Deformation

Data Source

PatentUS11982645B2Sensor system and method

Publication Date: 2024.05.14 GENERAL ELECTRIC CO

AI summary

A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.