Metallic Cap Internal Shielding for Electronic Chips
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Solution Overview
Problem
Electronic chips within components are vulnerable to electromagnetic radiation emitted by other parts of the same component, such as adjacent chips or wiring, which existing shielding technologies fail to adequately address.
Innovation Solution
A metallic cap is shaped to divide the enclosure into compartments, creating a separator that shields the electronic chip from internal electromagnetic radiation by forming a first and second compartment, with the cap being made of materials like aluminum, copper, or stainless steel, and optionally coated on polymer or plastic, ensuring effective internal shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metallic cap is shaped to divide the enclosure into compartments, then internal shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The metallic cap is shaped to divide the enclosure into at least a first compartment and a second compartment, creating internal separators that segment the space. This segmentation isolates the electronic chip from electromagnetic radiation sources in other compartments, effectively reducing harmful radiation exposure while maintaining a relatively simple overall structure.
2Reliability
If internal shielding structures are added to separate compartments, then electromagnetic radiation protection is improved, but manufacturing complexity increases
Solution Approach 1:
The metallic cap serves multiple functions simultaneously: it acts as the enclosure lid, provides internal shielding separators to divide compartments, and protects the electronic chip from electromagnetic radiation. By merging these functions into a single component, the design avoids adding separate shielding structures that would increase manufacturing complexity.
3Object-affected harmful factors
If the metallic cap is made of conductive materials like aluminum or copper, then electromagnetic shielding effectiveness is improved, but material cost increases
Solution Approach 1:
The metallic cap is formed as a thin shell or film structure that provides effective electromagnetic shielding with minimal material usage. The thin-film design maintains sufficient conductive properties for radiation blocking while significantly reducing the quantity of expensive metallic materials required compared to solid shielding structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides simple and effective internal shielding, reducing the impact of electromagnetic radiation on the chip by separating the compartments and minimizing exposure to radiation sources within the component.
Implementation Method 1
A metallic cap (11) is attached to a package base (12) to form an enclosure... The metallic cap (11) separates the enclosure into at least a first compartment (141) and a second compartment (142)... providing internal shielding
Data Source
AI summary
An electronic component is provided that includes a package base and a metallic cap. The metallic cap separates the enclosure into at least a first compartment and a second compartment. An electronic chip is in the first compartment, and the metallic cap separates the enclosure into the first and second compartments with its shape which forms a separator which extends from the ceiling of the first compartment toward the mounting plane of the electronic chip.