Microscale Metallic CNT Templated Devices

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Solution Overview

Problem

Current precision manufacturing of three-dimensional microscale structures is limited to low aspect ratios and a narrow range of materials, particularly for metals and metal alloys, which hinders the development of high sensitivity and stability in microelectromechanical systems (MEMS) such as gyros used in navigation and sensing applications.

Innovation Solution

The development of a microscale device featuring a patterned forest of vertically grown and aligned carbon nanotubes with a conformal coating and metallic interstitial material, where the metallic interstitial material is infiltrated using an electroplating process, allowing for the creation of high aspect ratio structures with a thickness of at least three microns and aspect ratios greater than 100:1, enabling robust and sensitive MEMS devices like gyros.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional precision manufacturing methods are used for microscale structures, then manufacturing simplicity is maintained, but aspect ratio is limited to low values and material selection is restricted

Engineering Contradiction:
Improveaspect ratioVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent uses carbon nanotube forests as an intermediary template structure. These forests are grown vertically to achieve high aspect ratios (greater than 100:1), then serve as molds for electroplating metallic interstitial material. This intermediary approach enables fabrication of high aspect ratio metal structures that would be impossible with conventional direct manufacturing methods.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the manufacturing approach from direct metal fabrication to a two-step process: first growing carbon nanotube forests with controlled height and density parameters, then electroplating metal into the interstices. This parameter transformation allows achieving aspect ratios greater than 100:1 and enables metal materials that were previously inaccessible at microscale.

Inventive Principle:
Principle #35Parameter changes

2Strength

If metals and metal alloys are used at microscale, then mechanical strength and stability are improved, but manufacturing barriers prevent high aspect ratio structure formation

Engineering Contradiction:
Improvestructural strengthVSAvoidaspect ratio
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent performs preliminary action by growing carbon nanotube forests with high aspect ratios before introducing the metal material. The nanotube forests are pre-formed with controlled height, density, and alignment, creating a template that guides subsequent metal electroplating. This preliminary structuring enables the final metal structure to inherit the high aspect ratio geometry.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent creates a composite structure consisting of carbon nanotube forests with infiltrated metallic interstitial material. The carbon nanotubes provide the high aspect ratio framework, while the metal material fills the interstices to provide mechanical strength and stability. This composite approach combines the advantages of both materials.

Inventive Principle:
Principle #40Composite materials

3Strength

If conformal coating is applied to carbon nanotube forests, then structural robustness is improved, but interstice filling may be compromised

Engineering Contradiction:
Improvestructural robustnessVSAvoidinterstice filling
Core Design Contradiction:
StrengthVSQuantity of substance

Solution Approach 1:

The patent applies conformal coating to the carbon nanotube surfaces, but intentionally leaves the interstices partially unfilled. The coating provides sufficient structural robustness for liquid processing while maintaining open interstices that allow metallic material to infiltrate during electroplating. This partial filling approach balances structural integrity with material infiltration.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the fabrication of high aspect ratio, three-dimensional microscale structures from metals and metal alloys, enhancing the sensitivity and stability of MEMS devices like gyros, achieving higher capacitance sensitivity and reduced drift performance, while being cost-effective and minimizing distortion and stress.

Implementation Method 1

The metallic interstitial material may be applied by an electroplating process

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11542156B1Microscale metallic CNT templated devices and related methods
Publication Date: 2023.01.03 CNT HLDG LLC
  • US11542156B1 patent drawing
  • US11542156B1 patent drawing
  • US11542156B1 patent drawing

AI summary

A method for forming a microscale device may include growing, by a chemical vapor deposition, a patterned forest of vertically aligned carbon nanotubes, wherein the patterned forest defines a component of the microscale device, and applying a conformal non-metal coating to the vertically aligned carbon nanotubes throughout the patterned forest, wherein the conformal non-metal coating comprises a substantially uniform thickness along a length of the vertically aligned carbon nanotubes. The method may also include connecting adjacent vertically aligned carbon nanotubes together with the conformal non-metal coating without filling interstices between the adjacent vertically aligned carbon nanotubes, wherein the connecting of the vertically aligned carbon nanotubes is configured to increase a strength of the vertically aligned carbon nanotubes of the patterned forest above a threshold level to withstand forces applied during a wet etching process, and infiltrating the interstices between the adjacent vertically aligned carbon nanotubes with a metallic material.