Metallic Cover Deformation Suppression for Compact Electronic Devices
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Solution Overview
Problem
Existing mechanically and electrically integrated electronic devices face challenges in effectively protecting circuit boards from dust and moisture while maintaining structural integrity and reducing the size of the casing, as conventional fixing methods can lead to deformation and interference with other components.
Innovation Solution
The electronic device features a metallic casing with a partitioned space for the circuit board and motor, a metallic cover with a protruding portion and elastic deformation suppressing elements, which are securely fitted to the casing using a receiving portion and recessed area, enhancing waterproof and dustproof sealing while minimizing casing size through efficient fixation without protruding elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the cover is made with a simple planar structure, then the manufacturing is simple, but the bending rigidity is insufficient causing deformation when fitting the protruding portion
Solution Approach 1:
The cover is divided into multiple functional regions: a planar portion for sealing, a protruding portion for fixation, and a deformation suppressing portion with through-holes to reduce bending rigidity in specific areas. This segmentation allows the cover to have both sufficient overall rigidity and controlled flexibility where needed.
Solution Approach 2:
The deformation suppressing portion introduces through-holes only in specific localized areas of the cover, rather than making the entire cover complex. This local modification reduces bending rigidity precisely where needed during assembly while maintaining structural integrity in other areas.
2Reliability
If conventional fixing methods are used, then the assembly is simple, but the circuit board is not adequately protected from dust and moisture
Solution Approach 1:
The protruding portion of the cover is fitted into a receiving portion formed in the casing, creating a nested fixation structure. This provides secure mechanical attachment and effective sealing against dust and moisture without requiring additional fasteners or complex fixing mechanisms.
Solution Approach 2:
The receiving portion in the casing acts as an intermediary structure that receives and secures the protruding portion of the cover. This intermediary feature enables reliable fixation and sealing while keeping both the cover and casing designs relatively simple.
3Volume of moving object
If the casing size is reduced for compact installation, then the installation flexibility increases, but the structural integrity and protection capability decrease
Solution Approach 1:
The sealing and protection functionality is enhanced by utilizing the vertical dimension with the protruding portion fitting into the receiving portion, rather than relying solely on horizontal expansion. This allows effective sealing in a compact volume by using depth/height for the fixation mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively seals the circuit board from dust and moisture, suppresses deformation, and allows for compact installation, reducing interference with other components by enhancing the bending rigidity and energy absorption, thus improving the overall reliability and installation flexibility of the electronic device.
Implementation Method 1
the cover has a deformation suppressing portion formed so that a bending rigidity with respect to a bending which is bent with a forming position of the protruding portion as a fulcrum and is directed to a protruding direction of the protruding portion
Implementation Method 2
the cover has an elastic portion extending in a radial direction around the forming position of the protruding portion
Data Source
AI summary
This electronic device includes a metallic casing that accommodates a component and a circuit board in respective spaces separated by a partition wall, and a metallic cover for protecting the circuit board by covering the casing. The cover has a protruding portion protruding toward the accommodating space for accommodating the circuit board, and the casing has a receiving portion to which the protruding portion is fitted at a position corresponding to the protruding portion. The cover has a deformation suppressing portion formed so that a bending rigidity with respect to a bending which is bent with a forming position of the protruding portion as a fulcrum and is directed to a protruding direction of the protruding portion as a fulcrum is greater than a bending rigidity in planar structure in a facing surface opposed to the circuit board.